Abstract: An input/output (I/O) host adapter in an I/O system processes I/O requests from a host system to a plurality of I/O devices. The host adapter includes a circuit to automatically transfer I/O requests from host memory to adapter memory. The host adapter also includes a circuit to automatically transfer I/O responses from adapter memory to host memory.

Abstract: A method and apparatus for reworking a Ball Grid Array (BGA) package is provided. The apparatus includes a housing with a solder ball compartment that includes solder balls; a sliding base plate positioned to slide under the solder ball compartment; and a BGA nest for supporting the BGA package and a stencil with a hole. The sliding base plate has a BGA nest holder adapted to receive the BGA nest with the BGA package and the stencil. The sliding base plate with the BGA nest, BGA package and the stencil moves underneath the solder ball compartment such that solder balls are placed on the BGA package through the stencil hole pattern. After the solder balls are placed on the BGA package, the sliding plate with the BGA package and the solder balls move in a second direction away from the solder ball compartment.

Abstract: One embodiment of the present invention provides a method of fabricating a semiconductor device including the steps of forming a first semiconductor layer; forming a second semiconductor layer over the first semiconductor layer; forming a mask over a first portion the second semiconductor layer; removing a second portion of the second semiconductor layer not covered by the mask; forming a first electrical connector on the first semiconductor layer; and forming a second electrical connector on the first portion of the second semiconductor layer.

Abstract: One embodiment of the present invention provides a module including a primary substrate defining a base of the module, wherein the primary substrate is provided with a plurality of vias for electrical connection to a photodetector located within an interior portion of the module; a side wall member joined to the primary substrate to form side walls of the module and to define the interior portion of the module; a secondary substrate positioned within the interior portion of the module, the photodetector being mounted on the secondary substrate; an optical fiber guide extending into the interior portion of the module from outside the module, the optical fiber being arranged to receive an optical fiber and to position the optical fiber so that light emerging from the optical fiber impinges upon the photodetector; and a lid joined to the side wall member to enclose the interior portion of the module.

Abstract: A security document form such as a bank draft, or other document of value may incorporate a see-through and write-able hologram or diffractive grating as an anticounterfeit measure. The hologram may extend over all or a portion of the form such as the signature entry area and other data entry areas of the form, e.g. the date, name and numerical value areas. A Previous patent utilizing metallized holograms for such applications does not permit good photocopying or microfilming of the document on account of their high reflectance. This photocopying problem is solved by using a see-through, writable hologram which allows clearly legible photocopies to be made for legitimate use but appearing clearly fraudulent when passed off as the original. An ink-compatible top surface is made by coating with ink-receptive material or by corona discharge treatment as is well known in the industry.