Patents Represented by Attorney Thoams S. Deibert

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  • Interpenetrating network for chemical mechanical polishing
    Patent number: 7635290
    Abstract: Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continuous non-fugitive phase and a substantially co-continuous fugitive phase. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.
    Type: Grant
    Filed: August 15, 2007
    Date of Patent: December 22, 2009
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Gregory P. Muldowney