Abstract: A method for rejuvenating a polishing slurry that has been used for a chemical-mechanical polishing process includes the steps of: recovering the polishing slurry; and re-dispersing abrasive grains contained in the polishing slurry recovered. Specifically, the abrasive grains may be re-dispersed by adding a dispersant or applying an electromagnetic field or ultrasonic radiation to the polishing slurry recovered.
Type:
Grant
Filed:
April 19, 2000
Date of Patent:
March 4, 2003
Assignee:
Matsushita Electric Industrial Co., Ltd.
Inventors:
Akihiro Tanoue, Yutaka Matsuzawa, Koji Shimizu