Abstract: An inspection system and method for inspecting a sidewall of a wafer to detect a wafer having a sidewall defect. The inspection system includes, a wafer revolver driven by a driving source for rotating the wafer, an image capturing unit for capturing image information of the sidewall of the wafer rotating by the wafer revolver, and an analyzer comparing captured image data to image data of a desired wafer sidewall and determining whether the inspected wafer is acceptable in accordance with the comparison. The image capturing unit may include an illuminator for illuminating the sidewall of the wafer rotated by the wafer revolver and a detector for capturing image data for the sidewall of the wafer illuminated by the illuminator.