Abstract: A multi-chip electronics module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.

Abstract: A transcoding arrangement transcodes television signals sampled at a first clock rate into second signals sampled at a second clock rate. An integer number of samples of the television signals are assembled into blocks, each block containing an integer number of samples of the second signal. The integers are selected to reduce the number of multipliers required to perform the transcoding. A delay element forms four successive delayed samples of the incoming television signal. The first and last delayed samples are summed and then multiplied by a running variable multiplicand to form a weighted sum signal. The second and third delayed samples are multiplied by respective running variable multiplicands to form second and third weighted delayed samples. The weighted second and third samples are summed to form a sum which is subtracted from the weighted sum signal to form the interpolated output sample.