Abstract: A method of manufacturing a semiconductor device, the method comprising: taking an SOI substrate comprising a bulk substrate, a buried insulating layer and an active layer, and implanting the bulk substrate from the side of and through the insulating layer and the active layer so as to generate an area having an increased doping concentration in the bulk substrate at the interface between the bulk substrate and the insulating layer.
Type:
Grant
Filed:
September 21, 2010
Date of Patent:
January 10, 2012
Assignee:
Texas Instruments Deutschland GmbH
Inventors:
Wolfgang Schwartz, Alfred Haeusler, Vladimir Frank Drobny