Abstract: Methods and apparatus for processing a service request received from a client are disclosed. When a service request is received, a plurality of packets are transmitted, where each of the plurality of packets identify a different type of service via which to send the corresponding packet. In addition, a mapping of each different type of service to an IP address is preferably maintained, thereby enabling the service request to be processed via an IP address associated with a type of service identified in a first one of the plurality of packets to be received.

Abstract: A pharmaceutical or dietetic dosage form comprising of effective quantity of an active substance chemically or physically bound to a support comprising sporopollenin, or other similar exine coating of spores, of a plant or fungus, optionally with further excipients.

Abstract: Provided are semiconductor low-K Si die wire bonding packages with package stress control and fabrication methods for such packages. The packages include molding interface material applied onto the low-K Si die. In general, the molding interface material is selectively applied onto the low-K Si die surface in order to minimize to safe levels the package stress experienced by the low-K Si die. Selective application includes defining various combinatorial patterns of coated and non-coated regions. In addition, selective application may also include a general application of molding interface material to create a stress buffer zone. The results are packages with less stress experienced by the low-K Si die and so improved reliability (in compliance with industry specifications).