Patents Represented by Attorney, Agent or Law Firm William F. Boley
  • Patent number: 6541107
    Abstract: Nanoporous silicone resins and silicone resin films having low dielectric constants and a method for preparing such nanoporous silicone resins. The silicone resin comprises the reaction product of a mixture comprising (A) 15-70 mol % of a tetraalkoxysilane described by formula Si(OR1)4,  where each R1 is an independently selected alkyl group comprising 1 to about 6 carbon atoms, (B) 12 to 60 mol % of a hydrosilane described by formula HSiX3,  where each X is an independently selected hydrolyzable substituent, (C) 15 to 70 mole percent of an organotrialkoxysilane described by formula R2Si(OR3)3,  where R2 is a hydrocarbon group comprising about 8 to 24 carbon atoms or a substituted hydrocarbon group comprising a hydrocarbon chain having about 8 to 24 carbon atoms and each R3 is an independently selected alkyl group comprising 1 to about 6 carbon atoms; in the presence of (D) water, (E) hydrolysis catalyst, and (F) organic solvent for the reaction product.
    Type: Grant
    Filed: October 25, 1999
    Date of Patent: April 1, 2003
    Assignee: Dow Corning Corporation
    Inventors: Bianxiao Zhong, Russell Keith King, Kyuha Chung, Shizhong Zhang
  • Patent number: 6420037
    Abstract: A silicone rubber based coating composition for air bags comprising about 0.1 to 50 wt % of spherical powder with an average particle size of about 10 &mgr;m to 300 &mgr;m.
    Type: Grant
    Filed: March 16, 2000
    Date of Patent: July 16, 2002
    Assignee: Dow Corning Toray Silicone Co. Ltd.
    Inventors: Yuichi Tsuji, Akito Nakamura
  • Patent number: 6395825
    Abstract: A method for hydrolyzing chlorosilanes having at least three chlorine atoms bonded to each silicon atom to form silicone resins. The method comprises adding at least one of hydridotrichlorosilane, tetrachlorosilane, or organotrichlorosilane to a two-phase mixture comprising a non-polar organic solvent, an aqueous phase comprising 0 to about 43 weight percent hydrochloric acid, and a surface active compound selected from the group consisting of organosulfates described by formula R2SO4H and alkali metal salts thereof, where R2 is selected from the group consisting of alkyl groups comprising about 4 to 16 carbon atoms and alkylphenyl groups comprising 7 to about 22 carbon atoms.
    Type: Grant
    Filed: April 28, 2000
    Date of Patent: May 28, 2002
    Assignees: Dow Corning Corporation, Dow Corning Asia, Ltd.
    Inventors: Gregory Scott Becker, Leslie Earl Carpenter, II, Russell Keith King, Tetsuyuki Michino, Eric Scott Moyer, Craig Rollin Yeakle
  • Patent number: 6359096
    Abstract: Soluble silicone resin compositions having good solution stability and a method for their preparation. The silicone resin comprises the reaction product of a mixture comprising (A) 15-70 mol % of a tetraalkoxysilane described by formula Si(OR1)4, where each R1 is an independently selected alkyl group comprising 1 to about 6 carbon atoms, (B) 12 to 60 mol % of a hydrosilane described by formula HSiX3, where each X is an independently selected hydrolyzable substituent, (C) 15 to 70 mole percent of an organotrialkoxysilane described by formula R2Si(OR3)3, where R2 is a hydrocarbon group comprising about 8 to 24 carbon atoms or a substituted hydrocarbon group comprising a hydrocarbon chain having about 8 to 24 carbon atoms and each R3 is an independently selected alkyl group comprising 1 to about 6 carbon atoms; in the presence of (D) water, (E) hydrolysis catalyst, and (F) organic solvent for the reaction product.
    Type: Grant
    Filed: October 25, 1999
    Date of Patent: March 19, 2002
    Assignee: Dow Corning Corporation
    Inventors: Bianxiao Zhong, Russell Keith King, Kyuha Chung, Shizhong Zhang
  • Patent number: 6313045
    Abstract: Nanoporous silicone resins and silicone resin films having low dielectric constants and a method for preparing such nanoporous silicone resins.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: November 6, 2001
    Assignee: Dow Corning Corporation
    Inventors: Bianxiao Zhong, Russell Keith King, Kyuha Chung, Shizhong Zhang
  • Patent number: 6303675
    Abstract: A silicone rubber composition comprising 0.01 to 50 weight percent of a perfluoroalkyl group-containing polydiorganosiloxane having on a side chain (F1) an organic group selected from the group consisting of polyoxyalkylene group-containing organic groups, C12 or higher alkyl group, and polydialkylsiloxane chain-containing organic groups, and having of a side chain or at a molecular chain terminal (F2) a perfluoroalkyl group-containing organic group described by the general formula F(CF2)a—R1—, where R1 is selected from the group consisting of an alkylene group, an alkyleneoxyalkylene group, and a group in which ═CO or —COO— is present in an alkylelne chain, and a is an integer of at least 3, and having a weight average molecular weight of at least 1000.
    Type: Grant
    Filed: February 21, 2000
    Date of Patent: October 16, 2001
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Hideki Kobayashi, Hiroshi Honma, Toru Masatomi
  • Patent number: 6299952
    Abstract: A moldable silicone rubber sponge composition comprising (A) 100 weight parts silicone rubber base compound with a Williams plasticity at 25° C. of 50 to 600 comprising (a) 100 weight parts diorganopolysiloxane gum that contains at least 2 alkenyl groups in each molecule and (b) 1 to 120 weight parts wet-process silica, (B) 0.01 to 50 weight parts hollow gas-containing thermoplastic resin powder, and (C) curing agent in an amount sufficient to effect curing of the composition. The invention is further a silicone rubber sponge afforded by the thermosetting of the above-defined moldable silicone rubber sponge composition and a method for producing the silicone rubber sponge.
    Type: Grant
    Filed: June 6, 2000
    Date of Patent: October 9, 2001
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Hiroshi Honma, Mitsuo Hamada
  • Patent number: 6297341
    Abstract: A silicone-containing polyimide resin, a silicone-containing polyamic acid, and methods for manufacturing these. More particularly, a silicone-containing polyimide resin with superior heat resistance and flexibility, a silicone-containing polyamic acid for which this polyimide resin is a raw material, and methods for manufacturing these.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: October 2, 2001
    Assignee: Dow Corning Toray Silicone Company LTD
    Inventors: Hiroshi Ueki, Yoshitsugu Morita, Haruhiko Furukawa
  • Patent number: 6294636
    Abstract: A silicone rubber composition, comprising: (A) an polyorganosiloxane gum represented by the following average structural formula: RaSiO(4−a)/2 (where R is a substituted or non-substituted monovalent hydrocarbon, and a is a number between 1.8 and 2.3); (B) microparticulate silica; and (C) a methyl-substituted benzoyl peroxide having the maximum grain diameter not exceeding 50 &mgr;m and an average grain diameter of 30 &mgr;m. When cured, the silicone rubber composition has reduced nonuniformity in the physical properties because of fewer voids, resulting in decreased frequency of spark-outs in the insulated wires.
    Type: Grant
    Filed: February 26, 1999
    Date of Patent: September 25, 2001
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Katsuya Baba, Kazuo Hirai, Takao Matsushita
  • Patent number: 6284861
    Abstract: A silicone rubber composition comprising (A) 100 weight parts of a polydiorganosiloxane mixture comprising (i) 1 to 99 wt % polydiorganosiloxane having at least two silicon atom-bonded vinyl groups per molecule and (ii) the remaining percentage of polydiorganosiloxane having at least two non-vinyl silicon atom-bonded alkenyl groups per molecule, (B) a polyorganosiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, (C) 0.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: September 4, 2001
    Assignee: Dow Corning Toray Silicone, Ltd.
    Inventors: Osamu Takuman, Makoto Yoshitake, Akito Nakamura
  • Patent number: 6281285
    Abstract: A method for hydrolyzing chlorosilanes having at least three chlorine atoms bonded to each silicon atom to form silicone resins. The method comprises adding at least one of hydridotrichlorosilane, tetrachlorosilane, or organotrichlorosilane to a two-phase mixture comprising a non-polar organic solvent, an aqueous phase comprising 0 to about 43 weight percent hydrochloric acid, and a surface active compound selected from the group consisting of alkylsulphonic acid hydrate, alkali metal salt of alkylsulphonic acid, arysulphonic acid hydrate, and alkali metal salt of arylsulphonic acid.
    Type: Grant
    Filed: June 9, 1999
    Date of Patent: August 28, 2001
    Assignees: Dow Corning Corporation, Dow Corning Asia, Ltd.
    Inventors: Gregory Scott Becker, Leslie Earl Carpenter, II, Russell Keith King, Tetsuyuki Michino, Eric Scott Moyer
  • Patent number: 6271299
    Abstract: Curable liquid silicone rubber compositions that are curable to form silicone elastomers which are useable as fire resistant sealants. These compositions have low heat release and form hard chars on burning, and comprise: (A) a liquid polyorganosiloxane polymer described by the formula  where each R1 is independently selected from the group consisting of alkyl, alkenyl, aryl, and halogenated alkyl groups having from 1 to 18 carbon atoms, each R2 is independently selected from the group consisting of hydroxyl, alkoxy, alkenyl, and alkynyl groups, and x is an integer having a value of from about 10 to 1500, (B) a cross-linking organosilicon compound having at least 3 silicon-bonded reactive groups, (C) a catalyst capable of promoting the reaction between the silicon-bonded R2 groups of Component A and the silicon-bonded reactive group of Component B, (D) wollastonite, and (E) an optional reinforcing filler.
    Type: Grant
    Filed: February 2, 1999
    Date of Patent: August 7, 2001
    Assignee: Dow Corning Corporation
    Inventors: Khristopher Edward Alvarez, Kiersten Lynn Shephard
  • Patent number: 6264865
    Abstract: A silicone rubber base compound for electrical wire coating such that when it is extruded using an extruding machine having a variable screw with an L/D=10 and a die with a diameter of 1 mm attached thereto at a barrel and head temperature of 70° C., the per-minute extruder output rate at a screw rotation speed of 100 rpm is not less than 1.2 times the extruder output rate at a screw rotation speed of 50 rpm, a silicone rubber composition for electrical wire coating obtained by compounding diacyl organic peroxide consisting of carbon atoms, hydrogen atoms, and oxygen atoms with the silicone rubber base compound for electrical wire coating, and a process for the production of silicone rubber coated electrical wire using the silicone rubber composition for electrical wire coating.
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: July 24, 2001
    Assignee: Dow Corning Toray Silicone Company, Ltd.
    Inventors: Katsuya Baba, Kenji Ota
  • Patent number: 6251182
    Abstract: The present invention is an improved susceptor for a float-zone apparatus for the float-zone processing of silicon elements. The susceptor is of a cylindrical design which allows the susceptor to be positioned around a free end of a silicon element to heat the free end of the silicon element to facilitate inductive coupling of the free end of the silicon element with an RF induction coil heater. In a preferred embodiment of the present invention, the susceptor is formed from tantalum.
    Type: Grant
    Filed: May 11, 1993
    Date of Patent: June 26, 2001
    Assignee: Hemlock Semiconductor Corporation
    Inventors: Joaquin Enrique Luna, Scott Allen Wheelock
  • Patent number: 6252030
    Abstract: A method for manufacturing an organic solvent-soluble hydrogenated octasilsesquioxane-vinyl group-containing compound copolymer comprising reacting 1 mol of (A) a hydrogenated octasilsesquioxane described by formula I with 0.2 to less than 3 mol of (B) a divinyl group-containing compound described by formula (2) CH2═CH—L—CH═CH2   Formula 2 where L is selected from the group consisting of (a) a divalent hydrocarbon group comprising 3 to 10 carbon atoms and (b) —(SiR2O)m—SiR2—, where each R is independently selected from the group consisting of alkyls comprising 1 to 6 carbon atoms and aryls comprising 6 to 9 carbon atoms and 1≦m≦10; in the presence of a hydrosilylation catalyst.
    Type: Grant
    Filed: March 9, 2000
    Date of Patent: June 26, 2001
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Gregg Alan Zank, Michitaka Suto
  • Patent number: 6239205
    Abstract: A silicone rubber composition comprising about 0.05 to 10 wt % cerium oxide powder having a BET specific surface area not less than 80 m2/g and a pH value measured of a 3 wt % aqueous dispersion thereof of about pH 2 to 5.5.
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: May 29, 2001
    Assignee: Dow Corning Toray Silicone Co.
    Inventors: Chiichiro Hasegawa, Junsuke Tokimatsu, Kazuhito Fujiwara
  • Patent number: 6239243
    Abstract: A method for the preparation of hydrophilic silica gels with high pore volume. In the preferred method a hydrophilic silica hydrogel treated with an organosilicon compound to effect hydrophobing of the silica hydrogel is heated in the presence of an oxidizing atmosphere to a temperature sufficient to reduce the hydrophobicity imparted by the surface treatment thereby producing a hydrophilic silica gel having high pore volume.
    Type: Grant
    Filed: June 10, 1999
    Date of Patent: May 29, 2001
    Assignee: Dow Corning Corporation
    Inventors: Qin Deng, James Richard Hahn, Kiersten Lynn Shephard
  • Patent number: 6232424
    Abstract: Soluble silicone resin compositions having good solution stability and a method for their preparation.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: May 15, 2001
    Assignee: Dow Corning Corporation
    Inventors: Bianxiao Zhong, Russell Keith King, Kyuha Chung, Shizhong Zhang
  • Patent number: 6221993
    Abstract: A continuous process for producing a silicone polymer comprises the sequential steps of (i) polymerisation of a linear silanol group containing siloxane by condensation polymerisation, or of a cyclosiloxane by ring opening polymerisation, or of a mixture of said linear and cyclosiloxanes with a phosphazene base in the presence of water and the presence or absence of a filler in an extruder, (ii) neutralising the reaction mixture in an extruder, and (iii) stripping the neutralised reaction mixture to remove volatile materials. Preferably, step (iii) is performed in an extruder, more preferably steps (i), (ii) and (iii) are all performed in the same extruder.
    Type: Grant
    Filed: August 26, 1999
    Date of Patent: April 24, 2001
    Assignee: Dow Corning Limited
    Inventors: John Currie, Phillip Griffith, William Herron, Richard Taylor
  • Patent number: 6218466
    Abstract: A method is provided that can very rapidly produce a liquid silicone rubber base in which even microfine electrically conductive filler with specific surface of at least 0.5 m2/g will be homogeneously dispersed in liquid organopolysiloxane without small lump or clump formation. The method for the continuous preparation of liquid silicone rubber base, including the steps of continuously supplying to a continuous mixing apparatus (A) 100 weight parts polyorganosiloxane that has a viscosity at 25° C. of 100 to 500,000 mPa·s comprising at least 2 silicon-bonded alkenyl groups in each molecule, (B) 0 to 200 weight parts electrically nonconductive inorganic filler, and (C) 0.1 to 700 weight parts electrically conductive filler with a specific surface of at least 0.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: April 17, 2001
    Assignee: Dow Corning Toray Silicone Co. Ltd.
    Inventors: Mitsuo Hamada, Koich Ishida, Atsushi Komatsu, Hidetoshi Kurusu, Hideyuki Mori, Toyohiko Yamadera