Abstract: The present invention provides a method for handling reordered data packets. A method comprises receiving a data packet and determining if the data packet is received out of order. The method further comprises delaying transmission of an acknowledgement indicating that a data packet is missing in response to determining that the data packet is received out of order.

Abstract: A method and an apparatus are provided for adjusting a sampling protocol in an adaptive control process. The method comprises determining a performance value based on a measurement associated with at least one or more previously processed workpieces, adjusting a sampling protocol for one or more processed workpieces based on the determined performance value, and measuring the one or more processed workpieces according to the sampling protocol to provide one or more measurements. The method further comprises adjusting at least one of a process model and a control parameter based on at least a portion of the one or more measurements.

Abstract: A method and an apparatus are provided for conflict resolution among a plurality of controllers. The method includes receiving a first control instruction from a first process controller to process a workpiece, receiving a second control instruction from a second process controller to process the workpiece and adjusting at least one of the first control instruction and the second control instruction to process the workpiece to achieve a desired process goal.

Abstract: An integrated circuit chip comprises a periphery portion and a memory portion. The memory portion includes a data storage layer and a logic layer formed underneath the data storage layer and is separated therefrom by an intermediate layer. A first conductive layer is formed within the intermediate layer to communicatively couple the periphery and memory portions of the integrated circuit chip, and a second conductive layer is formed within the intermediate layer to communicatively couple the periphery and memory portions of the integrated circuit chip. The first and second conductive layers provide addressing and data retrieval between the memory portion and the periphery portion.