Abstract: A chemical-mechanical polishing (CMP) control system controls distribution of pressure across the backside of a semiconductor wafer being polished. The system includes a CMP apparatus having a carrier for supporting a semiconductor wafer. The carrier includes a plurality of dual function piezoelectric actuators. The actuators sense pressure variations across the semiconductor wafer and are individually controllable. A control is connected to the actuators for monitoring sensed pressure variations and controlling the actuators to provide a controlled pressure distribution across the semiconductor wafer.

Abstract: An improved structure is provided for a window sash lock having a catch mounted to a face of a window frame to grasp and release a keeper reciprocally mounted to a face of a window sash. A housing (12) is mounted against the frame face (13) that has an opening therethrough with a portion substantially cylindrical about an axis perpendicular to the frame face (13). An operator (52) for the catch (32) comprises a cylindrical pivotal portion (56) which is receivable within the housing cylindrical portion and is adapted to pivot about the axis. The operator also includes a handle portion (54) secured at one end to the operator pivotal portion (56). The operator further comprises an actuator portion having a button (60) at one end for engaging the catch to control movement thereof. The actuator portion is secured at the other end to the operator pivotal portion. A part of the actuator portion is trapped between the housing and the frame face to prevent removal of the operator from the mounted housing.