Patents Assigned to 3 View Technology Co., Ltd.
  • Patent number: 7177159
    Abstract: A packaging structure of an electronic card includes a metal cover, a plastic frame and a printed circuit board. The metal cover is produced by providing a metal plate having a central portion and an edge portion and performing a draft operation on the metal plate such that the edge portion is vertical to the central portion. The plastic frame has a first surface combined with the metal cover. The printed circuit board is combined with a second surface of the plastic frame.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: February 13, 2007
    Assignee: 3 View Technology Co., Ltd.
    Inventors: Hank Wang, Hung Tse Wang
  • Publication number: 20070032122
    Abstract: An electronic device with a USB storage card disposed therein is disclosed. The electronic device comprises a containing space, a first connector disposed in the containing space, and a USB storage card disposed in the containing space and electrically coupled to the electronic device through the first connector for accessing files in the USB storage card. Therefore the inconvenience and the influence on the structure of the storage card caused by changing the storage card frequently can be avoided. Meanwhile, the risk of losing the storage card is also prevented and the trend of miniaturizing the electronic device and increasing the capacity of the storage card can be conformed by the design of the present invention.
    Type: Application
    Filed: June 21, 2006
    Publication date: February 8, 2007
    Applicant: 3 VIEW TECHNOLOGY CO., LTD
    Inventor: Hank Wang
  • Publication number: 20070011372
    Abstract: A signal adapter for signally connecting a USB storage card and a USB port of an electronic apparatus is disclosed. The signal adapter comprises a casing, a slot for inserting the USB storage card therein, a bridge disposed in the casing and electrically coupled to the USB storage card for transmitting a USB format signal from the USB storage card, and a USB connector electrically coupled to the bridge and being inserted into the USB port of the electronic apparatus for transmitting the USB format signal to the electronic apparatus through the USB port.
    Type: Application
    Filed: June 6, 2006
    Publication date: January 11, 2007
    Applicant: 3 VIEW TECHNOLOGY CO., LTD
    Inventor: Hank Wang
  • Patent number: 7049172
    Abstract: A packaging process of an electronic card is provided. Firstly, a first embedding operation is performed to embed a first metal cover into a first surface of a plastic frame. Then, a circuit board is placed on the plastic frame. Afterward, a second embedding operation is performed to embed a second metal cover into a second surface of the plastic frame. The circuit board is encapsulated into the plastic frame so as to form an electronic card package. The first metal cover, the plastic frame and the second metal cover are separately formed.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: May 23, 2006
    Assignee: 3 View Technology Co., Ltd.
    Inventors: Hank Wang, Sheng-Yuan Chen, Hung-Tse Wang
  • Publication number: 20050243532
    Abstract: A packaging structure of an electronic card includes a metal cover, a plastic frame and a printed circuit board. The metal cover is produced by providing a metal plate having a central portion and an edge portion and performing a draft operation on the metal plate such that the edge portion is vertical to the central portion. The plastic frame has a first surface combined with the metal cover. The printed circuit board is combined with a second surface of the plastic frame.
    Type: Application
    Filed: March 31, 2005
    Publication date: November 3, 2005
    Applicant: 3 VIEW TECHNOLOGY CO., LTD
    Inventors: Hank Wang, Hung-Tse Wang
  • Publication number: 20050176172
    Abstract: A packaging process of an electronic card is provided. Firstly, a first embedding operation is performed to embed a first metal cover into a first surface of a plastic frame. Then, a circuit board is placed on the plastic frame. Afterward, a second embedding operation is performed to embed a second metal cover into a second surface of the plastic frame. The circuit board is encapsulated into the plastic frame so as to form an electronic card package. The first metal cover, the plastic frame and the second metal cover are separately formed.
    Type: Application
    Filed: September 17, 2004
    Publication date: August 11, 2005
    Applicant: 3 VIEW TECHNOLOGY CO., LTD
    Inventors: Hank Wang, Sheng-Yuan Chen, Hung-Tse Wang
  • Patent number: 6546621
    Abstract: A package structure and method for a card comprises respective attachment of first and second conductive covers each having a vertical piece extending on one side thereof with first lateral surface of first and second plastic frames in use of a low temperature adhesive therebetween to form first and second half cases, and combination of the first and second half cases with insertion of another adhesive or sonic welding between second lateral surfaces of the first and second plastic frames. The plastic frame also has an outer surface formed with a recess to accommodate the vertical piece of the conductive cover and an adhesive area on the first lateral surface formed deep into the plastic frame to be coated with the low temperature adhesive in order for the attachment of the conductive cover.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: April 15, 2003
    Assignee: 3 View Technology Co., Ltd.
    Inventor: Hank Wang
  • Patent number: 6139357
    Abstract: A cable connector for the usual on-line computer peripheral interface card such as PCMCIA card or COMPACT FLASH card, comprising a main body portion and a connecting head outside which a substantially rigid pin is exposed. The main body portion and the connecting head being fixed together and directly disposed in a notch preset on an interface card to fix both the body portion and the interface card together by fixing the pin directly on a solder pad disposed on the circuit board. The main body portion being arranged and configured to receive a portion of a signal line, the fixing of the main body portion to the connecting head facilitating communication between the signal line and the pin.
    Type: Grant
    Filed: July 8, 1998
    Date of Patent: October 31, 2000
    Assignee: 3 View Technology Co., Ltd.
    Inventor: David Shih