Patents Assigned to 3 View Technology Co., Ltd.
-
Patent number: 7177159Abstract: A packaging structure of an electronic card includes a metal cover, a plastic frame and a printed circuit board. The metal cover is produced by providing a metal plate having a central portion and an edge portion and performing a draft operation on the metal plate such that the edge portion is vertical to the central portion. The plastic frame has a first surface combined with the metal cover. The printed circuit board is combined with a second surface of the plastic frame.Type: GrantFiled: March 31, 2005Date of Patent: February 13, 2007Assignee: 3 View Technology Co., Ltd.Inventors: Hank Wang, Hung Tse Wang
-
Publication number: 20070032122Abstract: An electronic device with a USB storage card disposed therein is disclosed. The electronic device comprises a containing space, a first connector disposed in the containing space, and a USB storage card disposed in the containing space and electrically coupled to the electronic device through the first connector for accessing files in the USB storage card. Therefore the inconvenience and the influence on the structure of the storage card caused by changing the storage card frequently can be avoided. Meanwhile, the risk of losing the storage card is also prevented and the trend of miniaturizing the electronic device and increasing the capacity of the storage card can be conformed by the design of the present invention.Type: ApplicationFiled: June 21, 2006Publication date: February 8, 2007Applicant: 3 VIEW TECHNOLOGY CO., LTDInventor: Hank Wang
-
Publication number: 20070011372Abstract: A signal adapter for signally connecting a USB storage card and a USB port of an electronic apparatus is disclosed. The signal adapter comprises a casing, a slot for inserting the USB storage card therein, a bridge disposed in the casing and electrically coupled to the USB storage card for transmitting a USB format signal from the USB storage card, and a USB connector electrically coupled to the bridge and being inserted into the USB port of the electronic apparatus for transmitting the USB format signal to the electronic apparatus through the USB port.Type: ApplicationFiled: June 6, 2006Publication date: January 11, 2007Applicant: 3 VIEW TECHNOLOGY CO., LTDInventor: Hank Wang
-
Patent number: 7049172Abstract: A packaging process of an electronic card is provided. Firstly, a first embedding operation is performed to embed a first metal cover into a first surface of a plastic frame. Then, a circuit board is placed on the plastic frame. Afterward, a second embedding operation is performed to embed a second metal cover into a second surface of the plastic frame. The circuit board is encapsulated into the plastic frame so as to form an electronic card package. The first metal cover, the plastic frame and the second metal cover are separately formed.Type: GrantFiled: September 17, 2004Date of Patent: May 23, 2006Assignee: 3 View Technology Co., Ltd.Inventors: Hank Wang, Sheng-Yuan Chen, Hung-Tse Wang
-
Publication number: 20050243532Abstract: A packaging structure of an electronic card includes a metal cover, a plastic frame and a printed circuit board. The metal cover is produced by providing a metal plate having a central portion and an edge portion and performing a draft operation on the metal plate such that the edge portion is vertical to the central portion. The plastic frame has a first surface combined with the metal cover. The printed circuit board is combined with a second surface of the plastic frame.Type: ApplicationFiled: March 31, 2005Publication date: November 3, 2005Applicant: 3 VIEW TECHNOLOGY CO., LTDInventors: Hank Wang, Hung-Tse Wang
-
Publication number: 20050176172Abstract: A packaging process of an electronic card is provided. Firstly, a first embedding operation is performed to embed a first metal cover into a first surface of a plastic frame. Then, a circuit board is placed on the plastic frame. Afterward, a second embedding operation is performed to embed a second metal cover into a second surface of the plastic frame. The circuit board is encapsulated into the plastic frame so as to form an electronic card package. The first metal cover, the plastic frame and the second metal cover are separately formed.Type: ApplicationFiled: September 17, 2004Publication date: August 11, 2005Applicant: 3 VIEW TECHNOLOGY CO., LTDInventors: Hank Wang, Sheng-Yuan Chen, Hung-Tse Wang
-
Patent number: 6546621Abstract: A package structure and method for a card comprises respective attachment of first and second conductive covers each having a vertical piece extending on one side thereof with first lateral surface of first and second plastic frames in use of a low temperature adhesive therebetween to form first and second half cases, and combination of the first and second half cases with insertion of another adhesive or sonic welding between second lateral surfaces of the first and second plastic frames. The plastic frame also has an outer surface formed with a recess to accommodate the vertical piece of the conductive cover and an adhesive area on the first lateral surface formed deep into the plastic frame to be coated with the low temperature adhesive in order for the attachment of the conductive cover.Type: GrantFiled: April 30, 2001Date of Patent: April 15, 2003Assignee: 3 View Technology Co., Ltd.Inventor: Hank Wang
-
Patent number: 6139357Abstract: A cable connector for the usual on-line computer peripheral interface card such as PCMCIA card or COMPACT FLASH card, comprising a main body portion and a connecting head outside which a substantially rigid pin is exposed. The main body portion and the connecting head being fixed together and directly disposed in a notch preset on an interface card to fix both the body portion and the interface card together by fixing the pin directly on a solder pad disposed on the circuit board. The main body portion being arranged and configured to receive a portion of a signal line, the fixing of the main body portion to the connecting head facilitating communication between the signal line and the pin.Type: GrantFiled: July 8, 1998Date of Patent: October 31, 2000Assignee: 3 View Technology Co., Ltd.Inventor: David Shih