Abstract: A MEMS microphone includes a substrate, a connecting base, and a capacitance system. Connecting ports are formed on the connecting base, where the at least two connecting ports are recessed outwards from an inner wall of the connecting base and are disposed at intervals. The capacitance system includes a system main body and connecting pins. A system main body of the capacitance system is fixed to the connecting ports of the connecting base through the connecting pins. In addition, the slit is formed between the outer side of the system main body and the inner wall of the connecting base, the capacitance system is stably and reliably assembled in the connecting base through a connecting structure where the connecting pins are matched with the connecting ports, and compliance of vibration of the system main body of the capacitance system is increased through matching the connecting pins with slit.

Abstract: One of the main objects of the present invention is to provide a speaker with optimized overall acoustic performance. To achieve the above-mentioned object, the present invention provides a speaker including: a base with an accommodation cavity; a vibration sounding assembly accommodated in the accommodation cavity, including a first diaphragm and a second diaphragm, and a driver fixed to the first diaphragm for driving the first diaphragm and the second diaphragm to vibrate and produce sound. The second diaphragm stacks on the first diaphragm, and a stiffness of the second diaphragm is different from a stiffness of the first diaphragm.

Abstract: The present disclosure discloses a MEMS speaker including a housing with a receiving space; a MEMS speaker chip with an inner cavity, accommodated in the receiving space and connected with the housing, the MEMS speaker chip dividing the receiving space into a first cavity and a second cavity communicating with the inner cavity; a sound hole communicating with the first cavity or the second cavity; and a damping mesh connected to the housing and covering the sound hole; wherein sounds emitted by the MEMS speaker chip transmit outward through the sound hole and the damping mesh. Compared with the related art, MEMS speaker disclosed by the present disclosure has a better reliability.