Abstract: An improved tool for spreading bonding compound, or the like, on planar surfaces which, in a first embodiment, includes a contoured surface having two end tip portions and a midportion contained in a plane spaced between the end tip portions. The tool includes a back which gives structural integrity to the tool, and a flexible application outer edge connected to the application face. In use, the bonding compound is applied to the planar surface, and the projecting flexible outer edge of the application face is forced against the wall and pulled along to obtain a flat surface to spread the plaster out along the planar surface to spread the bonding compound evenly and smoothly over the planar surface. The flexible outer edge can be removable and replaceable for adjusting to varying surfaces and for easy maintenance.