Abstract: An electronic chassis for enclosing and cooling electronic equipment is described that includes an oscillating heat pipe (OHP), wherein a first portion of the OHP extends into a rail of the chassis and a second portion of the OHP extends into the side panel on which the rail is located so that at least a portion of heat from operation of electronic equipment on a circuit card assembly (CCA) in contact with the rail passes through the rail to the OHP and from the OHP to a side panel of the chassis on which the rail is located where it is dissipated into an environment. In some instances, the side panel includes cooling fins. Also described is a method for forming such a chassis substantially of metal such as aluminum or its alloys using 3D printing or additive manufacturing.

Abstract: Heat sinks and thermal cooling systems are disclosed. The heat sinks and thermal cooling systems include fins, which extend away from a surface of a base of the heat sink, and which are located in a finned region on the surface. The heat sinks and thermal cooling systems also include one or more heat pipes that are positioned and shaped in a way so that a first portion of each heat pipe is in contact with the surface of the base, while at least a second portion of each heat pipe is raised above the surface of the base in into contact with fins in the finned region. Raising the heat pipes away from the surface of the base prevents components in contact with, or adjacent to, the base from being heated by the heat pipes.

Abstract: A circuit card assembly includes a heat sink, a locking mechanism, a first thermal path, and a second thermal path. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downward along the upper surface of the heat sink. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The first thermal path extends from the circuit board through the heat sink to the lower surface of the heat sink and removes thermal energy from the circuit board. The second thermal path is formed from the circuit board, through the heat sink, and then through the wedges to the holder. The second thermal path removes thermal energy from the circuit board that is greater than a leakage amount.

Abstract: Provided is an enclosure for encapsulating one or more printed circuit boards (PCBs) configured for having electronic devices mounted thereon. The enclosure includes a main chassis body including a bottom portion and an outer wall including connectable panels for encasing the main chassis body. The enclosure also includes a top portion configured for completing a seal between the main chassis body and the outer wall, wherein one of the PCBs forms one of the connectable panels.

Abstract: A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.