Abstract: A clip is provided for use on a loose-leaf binder having a spine with front and back covers and a plurality of rings for holding paper in the binder. The clip includes a U-shaped member having a base and outer legs adapted to engage outer surfaces of the binder covers, and a pair of inner legs extending from the base and being spaced from the outer legs so as to be adapted to engage the inner surfaces of the binder covers. A strap has a first end connected to the base of the U-shaped member and a second end with a loop adapted to be attached to the top binder ring to prevent the clip from becoming lost when detached from the binder. The clip has a small profile, with a width of approximately ¼ inch.

Abstract: A method for molding integrated circuit packages including a semiconductor integrated circuit chip and a lead frame with a plurality of leads is disclosed. The method employs a device formed of top and bottom mold dies having intermating teeth that provide a sealed mold cavity around the integrated circuit chip and the lead frame leads. The teeth of at least one of said mold dies are formed with inclined surfaces that assist in compensating for any misalignment between the lead frame and the dies.

Abstract: A device and method for molding integrated circuit packages including a semiconductor integrated circuit chip and a lead frame with a plurality of leads is disclosed. The device is formed of top and bottom mold dies having intermating teeth that provide a sealed mold cavity around the integrated circuit chip and the lead frame leads. The teeth of at least one of said mold dies are formed with inclined surfaces that assist in compensating for any misalignment between the lead frame and the dies.