Abstract: In accordance with the present invention, a new method, its structure and manufacturing method is described to reduce memory cell size about the half of the conventional method for a non-volatile NAND Flash cell. The control gates in a string of the NAND Flash cell array is formed as the combination of the drawn control gate and the self-aligned control gate by using a spacer method. The source and drain of a NAND cell is defined as the low doped region underneath the spacer.

Abstract: A DRAM having a theoretical cell layout efficiency of 100% and a density of up to four gigabits DRAM is obtained without sacrificing the storage capacitor values. This accomplishment is achieved by introducing landing pads in layout and obtaining narrow widths down to 1000A and small spaces down to 700 Å. The DRAM has active isolations, word lines, cup-shaped vertical capacitor walls, and bit lines. The process for forming small dimensions having this narrow width, narrow wall and the small space in ranges down 800 Å comprises depositing a form material on the surface of a product material. A portion of the form material is removed by RIE etching by using the lithography technique. A layer of masking material is deposited over the form material and product material, the layer of masking material having a thickness correlating to said desired width of product material. Masking material is removed by vertical RIE until the form material is exposed, leaving a predetermined width of masking material.

Abstract: A DRAM having a theoretical cell layout efficiency of 100% and a density of up to four gigabits DRAM is obtained without sacrificing the storage capacitor values. This accomplishment is achieved by introducing landing pads in layout and obtaining narrow widths down to 1000 .ANG. and small spaces down to 700 .ANG.. The DRAM has active isolations, word lines, cup-shaped vertical capacitor walls, and bit lines. The process for forming small dimensions having this narrow width, narrow wall and the small space in ranges down 800 .ANG. comprises depositing a form material on the surface of a product material. A portion of the form material is removed by RIE etching by using the lithography technique. A layer of masking material is deposited over the form material and product material, the layer of masking material having a thickness correlating to said desired width of product material. Masking material is removed by vertical RIE until the form material is exposed, leaving a predetermined width of masking material.