Abstract: A thin silver layer is deposited on the surface of a nonconducting substrate using an electroless process. The surface is cleaned and activated in aqueous solution containing stannous tin. The silver is deposited as a colloidal material from an aqueous solution of a silver-containing salt in the absence of an electric current, but in the presence of a deposition control agent. Optionally, the silver layer is stabilized with an aqueous solution of a platinum-group metal and/or gold. The resulting silver layer is uniform and of 2-2000 .ANG. thickness; it strongly adheres to the substrate.