Abstract: A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging.

Abstract: A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.

Abstract: A circuit board structure, a packaging structure and a method for making the same are disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.

Abstract: A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging.

Abstract: A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.

Abstract: A circuit board structure at least includes a patterned solder mask, a first conductive pattern, a second conductive pattern adjacent to the first conductive pattern and in direct contact with the patterned solder mask and a passivation respectively covering the first conductive pattern and the second conductive pattern.

Abstract: A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging.

Abstract: A method of manufacturing a package substrate. A carrier member is formed on an insulation protection layer on either of two surfaces of a core layer. The package substrate has the carrier member combined with one side thereof, and is prevented from being damaged during transportation or packaging due to reduced thickness.

Abstract: A method of manufacturing a package substrate. A carrier member is formed on an insulation protection layer on either of two surfaces of a core layer. The package substrate has the carrier member combined with one side thereof, and is prevented from being damaged during transportation or packaging due to reduced thickness.

Abstract: A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging.

Abstract: A pad structure includes a copper circuit pattern on a substrate, at least a gold layer stacked on the copper circuit pattern, and a nano-structured coating film stacked on the gold layer.

Abstract: A photothermosetting composition is described which contains a base resin (A), a photopolymerizable photomonomer or photooligomer (B), a photoinitiator (C), an epoxide compound containing at least two epoxy groups (D), and an organic solvent. The base resin (A) an epoxide compound (a) containing at least two epoxy groups, an unsaturated monobasic acid (b), a saturated or unsaturated dibasic acid (c), and a saturated or unsaturated acid anhydride (d) according to the ratio of (a)/(b)/(c) of 1:0.90˜0.95:0.025˜0.050 and the acid value of the base resin is in the range of 40˜49 mg KOH/g. This photothermosetting component was coating on the substrate, and then dried by baking, exposed by light, developed, irradiated by ultraviolet light or heated, and cured to form a solder mask.