Patents Assigned to Advance Materials Corporation
  • Patent number: 9084341
    Abstract: A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: July 14, 2015
    Assignee: Advance Materials Corporation
    Inventors: Lee-Sheng Yen, Doau-Tzu Wang
  • Patent number: 8987060
    Abstract: A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: March 24, 2015
    Assignee: Advance Materials Corporation
    Inventor: Lee-Sheng Yen
  • Patent number: 8836108
    Abstract: A circuit board structure, a packaging structure and a method for making the same are disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.
    Type: Grant
    Filed: July 14, 2010
    Date of Patent: September 16, 2014
    Assignee: Advance Materials Corporation
    Inventor: Lee-Sheng Yen
  • Publication number: 20140174644
    Abstract: A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging.
    Type: Application
    Filed: February 26, 2014
    Publication date: June 26, 2014
    Applicant: Advance Materials Corporation
    Inventors: Lee-Sheng Yen, Doau-Tzu Wang
  • Patent number: 8748234
    Abstract: A method for making the same is disclosed. First, a first substrate and a second substrate are provided. The first substrate includes a release film attached to a carrier. The second substrate includes a copper film covered with a solder mask. Second, the solder masked is patterned. Next, the release film and the patterned solder mask are pressed together so that the first substrate is attached to the second substrate. Then, the copper film is patterned to form a first pattern and a second pattern. The first pattern is in direct contact with the release film and the second pattern is in direct contact with the patterned solder mask. Later, a passivation is formed to cover the first pattern and the second pattern to form a circuit board structure. Afterwards, a package is formed on the carrier to form a packaging structure.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: June 10, 2014
    Assignee: Advance Materials Corporation
    Inventor: Lee-Sheng Yen
  • Patent number: 8742567
    Abstract: A circuit board structure at least includes a patterned solder mask, a first conductive pattern, a second conductive pattern adjacent to the first conductive pattern and in direct contact with the patterned solder mask and a passivation respectively covering the first conductive pattern and the second conductive pattern.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: June 3, 2014
    Assignee: Advance Materials Corporation
    Inventor: Lee-Sheng Yen
  • Patent number: 8698008
    Abstract: A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: April 15, 2014
    Assignee: Advance Materials Corporation
    Inventors: Lee-Sheng Yen, Doau-Tzu Wang
  • Patent number: 8628636
    Abstract: A method of manufacturing a package substrate. A carrier member is formed on an insulation protection layer on either of two surfaces of a core layer. The package substrate has the carrier member combined with one side thereof, and is prevented from being damaged during transportation or packaging due to reduced thickness.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: January 14, 2014
    Assignee: Advance Materials Corporation
    Inventors: Lee-Sheng Yen, Doau-Tzu Wang
  • Publication number: 20130180651
    Abstract: A method of manufacturing a package substrate. A carrier member is formed on an insulation protection layer on either of two surfaces of a core layer. The package substrate has the carrier member combined with one side thereof, and is prevented from being damaged during transportation or packaging due to reduced thickness.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 18, 2013
    Applicant: ADVANCE MATERIALS CORPORATION
    Inventors: Lee-Sheng Yen, Doau-Tzu Wang
  • Publication number: 20130146336
    Abstract: A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging.
    Type: Application
    Filed: December 12, 2011
    Publication date: June 13, 2013
    Applicant: ADVANCE MATERIALS CORPORATION
    Inventors: Lee-Sheng Yen, Doau-Tzu Wang
  • Patent number: 8102063
    Abstract: A pad structure includes a copper circuit pattern on a substrate, at least a gold layer stacked on the copper circuit pattern, and a nano-structured coating film stacked on the gold layer.
    Type: Grant
    Filed: January 11, 2010
    Date of Patent: January 24, 2012
    Assignee: Advance Materials Corporation
    Inventor: Lee-Sheng Yen
  • Patent number: 6555592
    Abstract: A photothermosetting composition is described which contains a base resin (A), a photopolymerizable photomonomer or photooligomer (B), a photoinitiator (C), an epoxide compound containing at least two epoxy groups (D), and an organic solvent. The base resin (A) an epoxide compound (a) containing at least two epoxy groups, an unsaturated monobasic acid (b), a saturated or unsaturated dibasic acid (c), and a saturated or unsaturated acid anhydride (d) according to the ratio of (a)/(b)/(c) of 1:0.90˜0.95:0.025˜0.050 and the acid value of the base resin is in the range of 40˜49 mg KOH/g. This photothermosetting component was coating on the substrate, and then dried by baking, exposed by light, developed, irradiated by ultraviolet light or heated, and cured to form a solder mask.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: April 29, 2003
    Assignee: Advance Materials Corporation
    Inventors: Chao-Hui Tseng, Fu-Lung Chen