Abstract: A heat pipe with a capillary structure that consists of heat conductive capillary grooves in the condenser region that meet with a porous wick in the evaporator section. The embodiments include several structures of the interface at the junction of the porous wick and the capillary grooves. One such interface is a simple butt joint. Others have interlocking shapes on the wick and the grooves such as parts of the wick that fit into or around the grooves.

Abstract: An evaporator for a loop heat pipe with high input heat transfer. The heat transfer is attained by constructing a heat pipe on the loop heat pipe evaporator heat input surface. The heat pipe then distributes the heat from limited input areas over the entire surface of the loop heat pipe evaporator, and that entire evaporator surface functions as the loop heat pipe heat input area as opposed to limited smaller areas into which the heat usually enters.

Abstract: Fuel reforming processes and systems are disclosed. The fuel reforming process includes providing a fuel reformer, the fuel reformer comprising a reaction zone configured for exothermic partial oxidation to generate reformates and a heat exchanger extending from the reaction zone, the heat exchanger configured to expel the reformates through a reformate path and receive fuel-rich reactants through a fuel path, generating the reformates by the exothermic partial oxidation of the fuel-rich reactants within the reaction zone, heating the fuel-rich reactants in reaction zone with the heat exchanger by heat from the reformates in the reformate path. The process is energetically self-sustained and operates without a catalyst. The fuel reforming system includes the fuel reformer with a spiral heat exchanger and a component capable of operation with the reformates and incompatible with combustion products, such as a fuel cell.

Abstract: An enclosure and method for housing electrical components. The enclosure includes walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. The at least one thermal transport device has a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion. The at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure.

Abstract: The apparatus is a heat transferring clamp with a heat pipe connecting the clamp's stationary base part to each moveable clamping part. A connecting heat pipe section between the heat pipe sections in the base part and each clamping part is flexible enough to permit both the required clamping and unclamping movements of the clamping part. The heat pipes thereby provide a superior heat transfer path between a clamped circuit board or other device and an available heat sink.

Abstract: A thermochemical process and system for producing fuel are provided. The thermochemical process includes reducing an oxygenated-hydrocarbon to form an alkane and using the alkane in a reforming reaction as a reducing agent for water, a reducing agent for carbon dioxide, or a combination thereof. Another thermochemical process includes reducing a metal oxide to form a reduced metal oxide, reducing an oxygenated-hydrocarbon with the reduced metal oxide to form an alkane, and using the alkane in a reforming reaction as a reducing agent for water, a reducing agent for carbon dioxide, or a combination thereof. The system includes a reformer configured to perform a thermochemical process.

Abstract: A vapor chamber structure which locks the upper planar plate lid to the lower planar plate base without the need for brazing and prevents distortion of the surfaces from internal pressure in the chamber. The basic structure has parallel rows of latching structures on the interior surfaces of the upper planar plate lid and the lower planar plate base. Each row of latching structures has a cross section in the shape the letter “L” with the top of the “L” attached to the interior surface of the lid so that the horizontal sections of the “L”s face the lower planar base plate when the chamber is assembled.

Abstract: An enclosure and method for housing electrical components. The enclosure includes walls provided about the electrical components, the walls having poor thermal conductivity. At least one thermal transport device extends through at least one respective wall. The at least one thermal transport device has a first portion which is positioned within the enclosure, a second portion which is positioned outside of the enclosure and a transition portion which connects the first portion to the second portion. The at least one thermal transport device has a high effective thermal conductivity and provides a high thermal conductivity path for heat energy to pass from within the enclosure to outside the enclosure.

Abstract: Fuel reforming processes and systems are disclosed. The fuel reforming process includes providing a fuel reformer, the fuel reformer comprising a reaction zone configured for exothermic partial oxidation to generate reformates and a heat exchanger extending from the reaction zone, the heat exchanger configured to expel the reformates through a reformate path and receive fuel-rich reactants through a fuel path, generating the reformates by the exothermic partial oxidation of the fuel-rich reactants within the reaction zone, heating the fuel-rich reactants in reaction zone with the heat exchanger by heat from the reformates in the reformate path. The process is energetically self-sustained and operates without a catalyst. The fuel reforming system includes the fuel reformer with a spiral heat exchanger and a component capable of operation with the reformates and incompatible with combustion products, such as a fuel cell.

Abstract: A multi-phase pump system and method that directs incoming two-phase flow into a fixed cylinder that contains a vortical flow. The system includes a momentum-driven, vortex phase separator, the phase separator accepting liquid-gas flows at any ratio from all liquid to all gas. The pump system also includes a liquid prime mover; a gas prime mover; and a control system. The vortical flow is driven by injecting the two-phase or another fluid stream tangent or approximately tangent to the curved surface of the cylindrical chamber. Inertial forces generated within the vortical flow drive a buoyancy-driven separation process within the cylindrical chamber. Single-phase prime movers are then used to pump the separated phases to a higher pressure.

Abstract: A semiconductor structure and method of manufacturing that has integrally-formed enhanced thermal management. During operation of a semiconductor device, electron flow between the source and the drain creates localized heat generation. A containment gap is formed by selectively removing a portion of the back side of the semiconductor device substrate directly adjacent to a localized heat generation area. A thermal management material is filled in the containment gap. This thermal management material enhances the thermal management of the semiconductor device by thermally coupling the localized heat generation area to a heat sink. The thermal management material may be a Phase Change Material (PCM) having a heat of fusion effective for absorbing heat generated in the localized heat generation area by the operation of the semiconductor device for reducing a peak operating temperature of the semiconductor device.

Abstract: The invention is a heat exchanger that transfers heat directly between fluids which are in direct contact with each other rather than being separated by a heat conductive wall. Gas and liquid exchange heat when the gas is moved into and through a mixing chamber, and is directed to form a high speed, forced vortex gas flow. The liquid is sprayed into the mixing chamber to form droplets traveling with and mixing with the vortex gas flow. As the gas and liquid droplets move through the mixing chamber together in the vortex flow, they exchange thermal energy by direct contact. The mixing chamber length is designed so that the gas and the liquid droplets approach thermal equilibrium as the gas-liquid mixture moves into a separation chamber. Within the separation chamber, the centrifugal force of the continuing vortex movement of the gas stream separates the liquid from the gas stream and forms a layer of liquid on the separation chamber wall.

Abstract: The invention is a heat exchanger transferring heat from a small heat source to a moving fluid. The inherent limitation of such a system is that most of the heat transfer to the fluid occurs only in the immediate vicinity of the heat input even though a large surface area heat transfer structure such as fins or small fluid passages is used to enhance the heat transfer within the heat exchanger. The invention adds a heat pipe inside the heat exchanger enclosure and in contact with the heat transfer structure. The heat pipe spreads the incoming heat over a larger part of the surface area of the heat transfer structure and improves the heat transfer to the cooling fluid by furnishing multiple heat transfer locations without adding extra thermal resistance between the heat source and the fluid flow.

Abstract: The apparatus is a capillary loop evaporator in which the vapor space is the internal volume of a cup shaped evaporator wick with sidewalls in full contact with the outer casing of the evaporator. Liquid is furnished to the wick through thicker wick wall sections, slabs protruding from the liquid-vapor barrier wick, eccentric wick cross sections, or tunnel arteries. The tunnel arteries can also be formed within heat flow reducing ridges protruding into the vapor space. The tunnel arteries can be fed liquid by bayonet tubes or cable arteries, and can be isolated from the heat source with regions of finer wick to impede vapor flow into the liquid. Tunnel arteries also enable separation of the evaporator and the reservoir for thermal isolation and structural flexibility. A wick within the reservoir aids collection of liquid in low gravity applications.

Abstract: The apparatus is a hybrid cooler which includes one loop within which a heated evaporator forms vapor that moves to a condenser because of the vapor pressure which also drives the liquid condensate from the condenser to a liquid reservoir. A second loop is powered by a mechanical pump that supplies liquid from the reservoir to the evaporator and the second loop also returns excess liquid not vaporized to the reservoir. An optional reservoir cooler can be used to assure that the reservoir temperature and vapor pressure are always lower that the temperatures and pressures of the evaporator and condenser.

Abstract: A refrigeration system including a compressor, condenser and evaporator utilizes an evaporative subcooler downstream of the condenser for subcooling the refrigerant for increased system efficiency. The strategic placement of the subcooler for cooling in the liquid zone allows the operating pressure and temperature of the refrigeration system to be reduced and the refrigerant in the system to provide the greatest cooling effect in the evaporator. As an additional feature, a counterflow heat exchanger is provided in the liquid zone adjacent the subcooler in order to provide additional subcooling and also provide for warming of the cooling water used for evaporative cooling. The subcooler can be readily used as a retrofit in an existing system and is particularly adapted for increasing efficiency in high capacity use situations, such as in the food industry. Preferably, condensate water is used for cooling in the evaporative subcooler, but tap water is used for makeup cooling water.

Abstract: A refrigeration system including a compressor, condenser and evaporator utilizes an evaporative subcooler downstream of the condenser for subcooling the refrigerant for increased system efficiency. The strategic placement of the subcooler for cooling in the liquid zone allows the operating pressure and temperature of the refrigeration system to be reduced and the refrigerant in the system to provide the greatest cooling effect in the evaporator. As an additional feature, a counterflow heat exchanger is provided in the liquid zone adjacent the subcooler in order to provide additional subcooling and also provide for warming of the cooling water used for evaporative cooling. The subcooler can be readily used as a retrofit in an existing system and is particularly adapted for increasing efficiency in high capacity use situations, such as in the food industry. Preferably, condensate water is used for cooling in the evaporative subcooler, but tap water is used for makeup cooling water.