Abstract: Shelf stable packaging films and packages which are microwaveable yet are substantially impermeable to gases and ultraviolet energy and selectively permeable to microwave energy are described. The films include a water vapor and oxygen barrier substrate having a first side upon which is deposited a metallic coating capable of selectively transmitting a portion of a microwave energy field through the substrate. The coating is formed in a plurality of discrete, microwave reflective areas separated by non-reflective gaps. The shape and spacing of the areas is varied so that the microwave energy transmission through non-coated areas of the barrier is sufficient to avoid arcing and heat the object but not cook the object. A food packaging system for storing and heating food by microwave energy, which includes the microwave barrier film of this invention, is also described.

Abstract: A selectively permeable membrane microwave susceptor for use in food packaging is disclosed. The susceptor comprises a substrate having at least one absorbing coating and at least one reflecting coating deposited thereon. Either one or both of the absorbing coating or the reflecting coating can be varied to control the amount of microwave energy reaching the absorbing coating, thereby controlling the overall amount of susceptor heating.

Abstract: A selectively permeable membrane microwave susceptor for use in food packaging is disclosed. The susceptor comprises a substrate having at least one absorbing coating and at least one reflecting coating deposited thereon. Either one or both of the absorbing coating or the reflecting coating can be varied to control the amount of microwave energy reaching the absorbing coating, thereby controlling the overall amount of susceptor heating.

Abstract: An etchless patterning method for depositing material patterns upon substrates. The method involves providing substrate to be patterned, immobilizing a patterned physical mask upon a mask carrier, transferring the mask from the carrier to contact the substrate, immobilizing the mask upon the substrate while removing the mask carrier, exposing the masked substrate to vapor phase pattern material in a vacuum, reimmobilizing the mask upon the mask carrier and removing the mask from the substrate in a manner that allows the mask to remain immobilized on the mask carrier. The process is particularly well suited for the production of circuit boards or electronic applications.