Abstract: An apparatus and method for wire termination in wire scribed circuit boards is provided. The system includes a plurality of wires having termination areas, scribed on an insulating substrate. The top portion of the termination areas is then removed by a router to expose the wire with a flat surface. The exposed portion of the wire is then covered by a metal suitable for electrical connection bonding.

Abstract: A non-tacky, solid, adhesive composition comprising: (a) at least one film forming polymeric resin of number average molecular weight (Mn) of at least about 10,000 and having a hydroxyl, epoxide or unsaturated functionality greater than about 7, the polymeric resin being selected from the group of polyols consisting of polyesters, polyurethanes, phenoxies, epoxies and mixtures thereof; a plasticizer present in an amount which permits the activation without C-staging of the polymeric resin; (b) a curing agent which is capable of crosslinking and curing the polymeric resin to a C-stage, the curing agent being present in an amount sufficient to C-stage the polymeric resin. The adhesive composition can be activated without C-staging the polymeric resin, upon application of sufficient heat or ultrasonic energy for a time period less than one second.

Abstract: An apparatus for detecting breaks in wire while the wire is being scribed wherein the apparatus measures changes, in real time, in the scribing system's electrical characteristics. These characteristics can be changes in phase shift and capacitance variations caused by breaks in the wire as the wire is scribed onto a workpiece.