Abstract: An integrated plasma desmearing and plated-through-hole method to first plasma desmear a printed circuit board and then plate through the holes of the plated circuit board by sputtering. The method comprises serially transporting the printed circuit boards through a plurality of vacuum chambers serially interconnected together by means of a transport system. The transporting method comprises the steps of passing the printed circuit board from one vacuum chamber into the succeeding vacuum chamber in such a manner that the printed circuit board is progressively released from suspension by longitudinally transportable clips to span the distance to the aligned transport mechanism in the succeeding vacuum chamber to be progressively gripped by the clips thereof. Preferably, five vacuum chambers are provided including a loading chamber, a desmearing chamber, a plating preparation chamber, a plating chamber and an unloading chamber. Airtight isolation doors isolate each chamber from the others.

Abstract: An apparatus for laminating layers of a book composed of printed circuit layers and adhesive layers, the apparatus comprising a press having an upper and lower bolster plate positioned within a vacuum chamber. A platen assembly including a bookshelf and a chamber platen positioned apart from one another is positioned between the upper and lower bolster plates allowing the book to be placed on the bookshelf. Upon actuation of the press, the bookshelf and the chamber platen engage one another to compress the book positioned therebetween. The chamber platen may be heated or cooled.

Abstract: An integrated plasma desmearing and plated-through-hole apparatus for first plasma desmearing a printed circuit board and then plating through the holes of the plated circuit board by sputtering. The apparatus comprises a plurality of vacuum chambers serially interconnected together. Preferably, five vacuum chambers are provided including a loading chamber, a desmearing chamber, a plating preparation chamber, a plating chamber and an unloading chamber. Airtight isolation doors isolate each chamber from the others. A transport system is provided for serially transporting the printed circuit boards through the chambers.

Abstract: A lamination apparatus is disclosed which includes serially interconnected loading vacuum chamber, press vacuum chamber and an unloading vacuum chamber. An input transport system is positioned within the loading chamber to transport a printed circuit board book therefrom into the press chamber. An output transport system is likewise positioned in the unloading chamber to remove the printed circuit board book from within the press chamber into the unloading chamber for unloading. The loading and unloading vacuum chambers isolate the press positioned within the press chamber from atmospheric pressure as the printed circuit board books sequentially flow through the lamination apparatus.

Abstract: A paired electrode for use in a plasma chamber. In one embodiment, the paired electrode comprises a plurality of angle members which are disposed parallel to one another. Pairs of the angle members are positioned facing one another, one functioning as a power electrode member and the other as a ground electrode member. All of the power electrode members are rigidly fastened to one another by means of a transverse power bus and all of the ground electrode members are rigidly fastened to one another by means of a transverse ground bus. The power bus and the ground bus are electrically connected to a power source, usually a RF power source and a ground of the plasma chamber, respectively. The plasma chamber contains a plurality of paired electrodes, and objects to be processed by plasma are placed between the paired electrodes.