Patents Assigned to Advanced Systems Automation PTE Ltd.
  • Patent number: 5680746
    Abstract: The present invention has at least a continuous belt or chain, a sliding bar, at least two drivers--one for moving and driving the belt--, and a plurality of constraining rollers for guiding the belt around all the other components such that the portion of the belt between the rollers and the extreme ends of the sliding bar is substantially parallel thereto. Suction cups or grippers disposed at regular intervals along the belt and having distance which is greater or equal to that of the tray pitch and frame pitch picks up outputs from a packaging system and places such outputs into carrier trays. The sliding bar accommodates automaticaly troy change without interrupting the operating of the packaging system. By matching the flow of outputs from packaging system with that of the offloading trays, space economy is achieved without requiring modification to existing packaging systems.
    Type: Grant
    Filed: December 6, 1996
    Date of Patent: October 28, 1997
    Assignee: Advanced Systems Automation Pte. Ltd.
    Inventor: Frank Hornisch
  • Patent number: 5645776
    Abstract: A method for encapsulating semiconductor devices includes the steps of: providing a molding system and a close-loop control system which is coupled to the molding system, the close-loop control system including a computer, a programmable logic control, a servo motor controller, and at least two drivers, wherein the servo motor controller is coupled to the computer and the programmable logic control, respectively, the servo motor controller is further coupled to the drivers, and the drivers are coupled to the molding system; clamping together at least one set of top and bottom molds of the molding system, the molding system including a clamping assembly having a clamping axis, the close-loop control system being coupled to the clamping assembly; feeding a molding compound into a cavity formed by a space between at least one set of top and bottom molds, the molding system further including a transfer assembly having a transfer axis; alternating a gear switching assembly of the molding system between a high spee
    Type: Grant
    Filed: July 18, 1996
    Date of Patent: July 8, 1997
    Assignee: Advanced Systems Automation PTE, Ltd.
    Inventor: Tiang Siong Lian
  • Patent number: 5533336
    Abstract: The present invention describes an apparatus for achieving power amplification in general press and elevating systems with enhanced control and without the disadvantages of the pneumatic and angle-linked devices. A motor is coupled to a screw and nut for delivering force to at least one transfer piston within a fixed volume at the base of a larger piston. Amplification of power is attained when transfer piston displaces the fluid within the fixed volume. A pressure sensor in the fixed volume and coupled to the motor provides the closed loop feedback required of the control of power amplification. The change in force exerted by the transfer piston has linear relationship with the change in power output of the larger piston.
    Type: Grant
    Filed: March 17, 1994
    Date of Patent: July 9, 1996
    Assignee: Advanced Systems Automation Pte Ltd
    Inventors: Ho B. Kiat, Tan H. Choy
  • Patent number: 5522713
    Abstract: A direct drive electro-mechanical press for encapsulating semiconductor devices has at least a clamping axis and a transfer axis. The clamping axis has a planetary roller screw coupled to a tie bar platen assembly on which at least one top mold is mounted. A two-speed gearbox is further coupled to the clamping axis for switching between a high speed mode and a high torque mode along the clamping axis. The two-speed gearbox has a high speed clutch coupled to a speed reducer and a high torque clutch respectively. The transfer axis is slidably located above the clamping axis; the transfer axis has another planetary roller screw coupled to a bottom platen on which at least one bottom mold is mounted. The transfer axis transfers the molding resin from the pot into the cavities formed when the top and bottom molds are clamped together.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: June 4, 1996
    Assignee: Advanced Systems Automation PTE Ltd.
    Inventor: Tiang S. Lian