Abstract: A thermoconductive module to control the temperature of a DUT including a top surface having an area and a topography comprising, in combination, a heat exchange surface for interfacing and engaging with the top surface of the DUT, a plurality of individually moveable elements arranged throughout the area of the top surface of the DUT for moving the heat exchange surface to contour the heat exchange surface to map the topography of the top surface of the DUT and means in thermal communication with the heat exchange surface for producing the heat transfer between the top surface of the DUT and the heat exchange surface.

Abstract: An invertor (10) is disclosed including first and second probes (12, 14) which are pivotably mounted to a U-shaped housing (20) and to a block (18) which is reciprocally mounted to the housing (20) by guide shafts (38). The block (18) is reciprocated by a rotary actuator (42) between a first position where the probes (12, 14) are in a parallel relation and a second position where the probes (12, 14) are in line. The suction pin (80) of the first probe (12) is extended to attach to the first surface (96) of the chip (98) and then retracted. The probes (12, 14) are then moved to their in line relation where the chip (98) is passed from the first probe (12) to the second probe (14) by attaching the opposing surface (100) of the chip (98) to the suction pin (80) of the second probe (14). After moving the probes (12, 14) to their parallel relation, the suction pin (80) of the second probe (14) is extended to place and release the chip (98).

Abstract: Apparatus (10) for handling devices for testing under varying temperature conditions is disclosed including a mechanical arm (32) pivotally mounted by a bearing (34) to a control portion (16) which is variably vertically positionable relative to a platform portion (14). An insert arm (38) is rotatably mounted within the mechanical arm (32) to reciprocally and rotatably mount a thermal socket (90) for mating with a contactor (126). The socket (90) is mounted to a vacuum cup (48) to allow position alignment as alignment pins (132) are initially slideably received in alignment notches (124) and when no vacuum is applied and is fixed in the aligned position after the application of vacuum. Thermal tubes (74) of probes (50) are reciprocal with the thermal socket (90) to provide thermally conditioned gas/air to the thermal socket (90). The thermal socket (90) provides a swirling action to the thermally conditioned gas/air to exit 360.degree.

Abstract: An invertor (10) is disclosed including first and second probes (12, 14) which are pivotably mounted to a U-shaped housing (20) and to a block (18) which is reciprocally mounted to the housing (20) by guide shafts (38). The block (18) is reciprocated by a rotary actuator (42) between a first position where the probes (12, 14) are in a parallel relation and a second position where the probes (12, 14) are in line. The suction pin (80) of the first probe (12) may be extended to attach to the first surface (96) of the chip (98) and then retracted. The probes (12, 14) may then be moved to their in line relation where the chip (98) may be passed from the first probe (12) to the second probe (14) but attaching the opposing surface (100) of the chip (98) to the suction pin (80) of the second probe (14). After moving the probes ( 12, 14) to their parallel relation, the suction pin (80) of the second probe (14) may be extended to place and release the chip (98).

Abstract: Apparatus (10) for handling devices for testing under varying temperature conditions is disclosed including a mechanical arm (32) pivotally mounted by a bearing (34) to a control portion (16) which is variably vertically positionable relative to a platform portion (14). An insert arm (38) is rotatably mounted within the mechanical arm (32) to reciprocally and rotatably mount a thermal socket (90) for mating with a contactor (126). The socket (90) is mounted to a vacuum cup (48) to allow position alignment as alignment pins (132) are initially slideably received in alignment notches (124) and when no vacuum is applied and is fixed in the aligned position after the application of vacuum. Thermal tubes (74) of probes (50) are reciprocal with the thermal socket (90) to provide thermally conditioned gas/air to the thermal socket (90). The thermal socket (90) provides a swirling action to the thermally conditioned gas/air to exit 360.degree.

Abstract: A controlled impedance testsite for the testing of integrated circuits, including matched impedance cables. Decoupling capacitors are used in the matched impedance cables in test situations where high frequency decoupling is required. The testsite includes a socket style ejector and a spring return. The contacts are a flat wire style affixed to the flexible Kapton matched impedance cables. A contact board and BUS board are positioned for decoupling purposes at one end of each cable adjacent to the contact area of the testsite and the integrated circuit to be tested. A hard PWB with connection pins affixed is used as a termination contact point, and is positioned at the opposing end of each flexible cable.