Abstract: An apparatus (10) for simultaneously inverting a plurality of semiconductor devices includes a conveyor (12) for conveying an input tray below a frame (32) having a primer tray captured therein by tray captivators (64). The input tray is elevated by an elevator (20) and the primer tray is lowered by lowering the frame (32) until the trays are closely adjacent. After the tray captivators (64) release the primer tray, tray clamps (44) are moved inwardly to extend over the sides of the trays, and jaws (52, 56) are moved to clamp the trays together. The frame (32) is rotated to invert the clamped trays. The input tray s then captured by the tray captivators (64) as the tray lamps (44) are released and acts as the primer tray for the next operation. After release of the tray clamps (44), the ay including the devices in an inverted orientation is lowered to be conveyed by the conveyor (12).

Abstract: A system (10) for performing semiconductor reliability tests is disclosed including an oven (36) having open axial ends for slideably receiving a board (12). The board (12) includes an oven region (16) which is removably received in the oven (36) and which is located intermediate connection and exterior regions (14, 18) located axially outside of the oven (36). A temperature sensor (30) is positioned in the oven region (16) and its calibration device (32) is located in the exterior region (18). Contacts (34) on the axial free edge of the connection region (14) are slideably received in an electrical connector (72). The board (12) is formed of low heat transfer material so that the connection and exterior regions (14, 18) and the electrical connector (72) is not heated by the oven (36) and includes a handle (22) on the axial free edge of the exterior region (18).

Abstract: A microchip handling system has a pair of probes with suction cups for handling microchips. An improved microchip holding device is used in lieu of the suction cups to pick up and hold microchips. The microchip holding device has a head accommodating an annular sleeve that retains the microchip in spaced holding relationship relative to a body. The sleeve establishes a large annular space whereby the vacuum force has a large surface area for holding the microchip in engagement with the sleeve.

Abstract: A handling system for devices under test (DUTs), i.e. semiconductor chips. A rotatable platform is provided which platform has a plurality of boats or nests. The DUTs are inserted in the boats. The platform carrying the DUTs is indexed through a plurality of treatment stations to precondition the chips specifically to bring the chip to a test temperature. At a test station, the chip is removed from the boat and inserted into a manufacturer's test head. The chip is tested, returned to the boat and indexed to a treatment station(s) downstream of the test head where is ultimately removed for further processing.

Abstract: A microchip tray handling apparatus has microchip loading and receiving units for supplying microchips to a microchip tester and receiving tested microchips. The units have tables to support stacks of trays containing microchips. Each unit has a tray holding assembly for raising a stack of trays to allow a bottom tray to be moved along the table. Pick, invert and place probes remove micro chips from the trays and place tested microchips back into the trays.