Abstract: The apparatus and method of the present invention relates use a dry atmosphere in the component storage portion of the surface mount device placement machine. The dry atmosphere provides the benefit of eliminating the baking process and other moisture management issues. In accordance with one aspect of the present invention, a component placement machine for placing components on printed circuit boards includes a component storage area, a component placement system for taking components from the component storage area and placing the components on the printed circuit boards, an enclosure surrounding the component storage area, and a dry gas delivery system for delivery of a dry gas to the storage area to prevent moisture from being absorbed by the components.

Abstract: A method and apparatus for increasing spatial energy coverage in a furnace is provided. The apparatus of the present invention includes a panel positioned at least partially into a sidewall of a furnace. The panel includes a plurality of openings for injecting a material through each of the openings at least partially during the same time period. The method of the present invention includes positioning the panel at least partially within the sidewall of a furnace. The method also includes injecting at least partially during the same time period, a primary combustion material, a secondary combustion material, and a particulate material, into the furnace.

Abstract: Provided are a preconditioned resin and methods of preparation thereof as well as methods for purifying hydrogen peroxide solutions. The method includes preconditioning an anion exchange resin, wherein an anion exchange resin bed is provided and carbon dioxide gas is passed through the resin bed.