Abstract: A thin metal substrate having high thermal conductivity includes a copper foil layer, an insulating polymer layer and a thermal conductive adhesive layer. The thermal conductive adhesive layer has a resin and a thermal conductive powder dispersed in the resin. The insulating polymer layer is disposed between the copper foil layer and the thermal conductive adhesive layer. Since the thermal conductive adhesive layer has the thermal conductive powder and the insulating polymer layer has insulating and anti-breakdown abilities, the substrate has a reduced thickness, high heat dissipating efficiency and improved insulating performance.
Type:
Grant
Filed:
April 3, 2012
Date of Patent:
February 27, 2018
Assignee:
AISA ELECTRONIC MATERIAL CO., LTD
Inventors:
Meng Hao Chang, Chien Hui Lee, J. King Chen
Abstract: A thin metal substrate having high thermal conductivity includes a copper foil layer, an insulating polymer layer and a thermal conductive adhesive layer. The thermal conductive adhesive layer has a resin and a thermal conductive powder dispersed in the resin. The insulating polymer layer is disposed between the copper foil layer and the thermal conductive adhesive layer. Since the thermal conductive adhesive layer has the thermal conductive powder and the insulating polymer layer has insulating and anti-breakdown abilities, the substrate has a reduced thickness, high heat dissipating efficiency and improved insulating performance.
Type:
Application
Filed:
April 3, 2012
Publication date:
February 14, 2013
Applicant:
AISA ELECTRONIC MATERIAL CO., LTD
Inventors:
Meng Hao Chang, Chien Hui Lee, J. King Chen