Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.
Abstract: A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.
Abstract: A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.
Abstract: A probe pin cleaning pad is provided, including a release layer or composite plate, an adhesive layer, a substrate layer, and a cleaning layer. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. A cleaning method for a probe pin is also provided.
Type:
Application
Filed:
November 12, 2020
Publication date:
May 13, 2021
Applicant:
Alliance Material Co., Ltd.
Inventors:
Chun-Fa Chen, Chi-Hua Huang, Yu-Hsuen Lee, Chen-Ju Lee, Huan-Hsuan Ku, Ching-Wen Hsu, Chin-Kai Lin