Patents Assigned to Alti-Electronics Co., Ltd.
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Patent number: 8072557Abstract: A display device is disclosed in the present invention. The display device includes a case including an install space inside the case, an opened display area at a front face of the case and a slit at a side of the case, the slit connected to the install space, a display panel attached to the case at the install space to be exposed to the display area, a backlight unit installed at the install space after the display panel through the slit by sliding engagement.Type: GrantFiled: August 7, 2008Date of Patent: December 6, 2011Assignee: Alti-Electronics Co., LtdInventors: Dong-Soo Kim, Haw-Kyung Choi
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Patent number: 8013357Abstract: Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.Type: GrantFiled: July 1, 2009Date of Patent: September 6, 2011Assignee: Alti-Electronics Co., LtdInventors: Kyoung-Il Park, Jin-Won Lee, Sun-Hong Kim, Min-Sik Kim, Ji-Na Lee
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Patent number: 7967490Abstract: The present invention provides a backlight unit including an LED module and a frame separately, and each separated part is stable and is capable of simple use and assembly. The backlight unit of direct type includes a plurality of makeup LED modules including an LED package of direct type on a PCB and a heat sink releasing heat generated from driving the LED package of direct type, a reflection plate reflecting light emitted from the makeup LED module to a front face, and attached at the remaining surface except for the makeup LED packages, an optical sheet disposed on the reflection plate, and improving brightness and uniformity of the light emitted from the makeup LED module and the reflection plate, and guide the light into a front face of the optical sheet and a frame including a guide rail to combine the makeup LED module by a sliding combination.Type: GrantFiled: June 27, 2008Date of Patent: June 28, 2011Assignee: Alti-Electronics Co., Ltd.Inventors: Dong-Soo Kim, Hwa-kyung Choi
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Patent number: 7910948Abstract: A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.Type: GrantFiled: June 12, 2009Date of Patent: March 22, 2011Assignee: Alti-Electronics Co., Ltd.Inventors: Sun-Hong Kim, Jin-Won Lee, Kyoung-Il Park
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Patent number: 7847300Abstract: Disclosed is a light-emitting diode package. The light-emitting diode package includes an electrode pad on which a chip is placed; a housing having a window through which the chip is exposed; a housing wall defining the window; and an electrode lead extended from the electrode pad in a direction of the housing to be exposed outside a surface of the housing, wherein the housing wall formed in the direction comprises a first portion and a second portion thicker than the first portion to cover the electrode lead.Type: GrantFiled: March 28, 2008Date of Patent: December 7, 2010Assignee: Alti-Electronics Co., Ltd.Inventors: Sun-Hong Kim, Min-Sik Kim, Jin-Na Lee
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Publication number: 20100019267Abstract: A side view type light emitting diode (LED) and a method of manufacturing the same are disclosed. In one embodiment, the LED includes i) a pair of lead frames, ii) a reflector surrounding the lead frames, wherein a groove is defined in the reflector, wherein the reflector comprises a plurality of walls surrounding the groove, and wherein at least two walls of the groove face each other, iii) an LED chip mounted in the groove and electrically connected to the lead frames and iv) a lens array contained in the groove.Type: ApplicationFiled: October 2, 2009Publication date: January 28, 2010Applicant: ALTI-ELECTRONICS CO., LTD.Inventors: Ik-Seong PARK, Jin-Won Lee, Chi-Ok In, Sun-Hong Kim
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Patent number: 7652306Abstract: A light-emitting diode (“LED”) package is disclosed. The LED package includes a substrate, a pad frame, an LED chip and a housing. The pad frame includes a conductive lead divided by insulation materials on the substrate. The LED chip is mounted on the conductive lead. The housing surrounds the LED chip and the conductive lead, and has opening recess exposing the LED chip and a part of the conductive lead. The conductive lead includes a protrusion extended in both directions substantially perpendicular to a longitudinal direction of the housing.Type: GrantFiled: March 27, 2008Date of Patent: January 26, 2010Assignee: Alti-Electronics Co., LtdInventors: Jin-Won Lee, Kyoung-Il Park, Sun-Hong Kim
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Publication number: 20100001308Abstract: Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.Type: ApplicationFiled: July 1, 2009Publication date: January 7, 2010Applicant: Alti-Electronics Co.,Ltd.Inventors: Kyoung-Il PARK, Jin-Won LEE, Sun-Hong KIM, Min-Sik KIM, Ji-Na LEE
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Publication number: 20090309122Abstract: A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.Type: ApplicationFiled: June 12, 2009Publication date: December 17, 2009Applicant: ALTI-ELECTRONICS CO., LTD.Inventors: Sun-Hong Kim, Jin-Won Lee, Kyoung-Il Park
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Patent number: 7598101Abstract: A side view type light emitting diode and a method of manufacturing the same are disclosed. The method may include (a) providing lead frames which include a cathode terminal and an anode terminal, (b) forming a reflector which surrounds the lead frames, such that portions of the cathode terminal and anode terminal protrude from both sides, and which includes a groove open in the upward direction and a wall surrounding the groove, (c) die-attaching an LED chip onto the lead frames inside the groove, (d) bonding the LED chip to the cathode terminal or to the anode terminal with a conductive wire, (e) dispensing a liquid curable resin into the groove to form a lens part and (f) sawing the walls facing each other using a sawing machine such that the thicknesses at the upper surfaces are about 0.04 mm to about 0.05 mm.Type: GrantFiled: October 4, 2007Date of Patent: October 6, 2009Assignee: Alti-Electronics Co., Ltd.Inventors: Ik-Seong Park, Jin-Won Lee, Chi-Ok In, Sun-Hong Kim
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Patent number: D601517Type: GrantFiled: June 26, 2008Date of Patent: October 6, 2009Assignee: Alti-Electronics Co., Ltd.Inventors: Chi-Ok In, Jong-Won Park
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Patent number: D601518Type: GrantFiled: August 22, 2008Date of Patent: October 6, 2009Assignee: Alti-Electronics Co., LtdInventors: Jin-Won Lee, Kyoung-Il Park, Sun-Hong Kim
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Patent number: D602449Type: GrantFiled: August 18, 2008Date of Patent: October 20, 2009Assignee: Alti-Electronics Co., LtdInventors: Dong-Soo Kim, Hwa-Kyung Choi
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Patent number: D605608Type: GrantFiled: November 21, 2008Date of Patent: December 8, 2009Assignee: Alti-Electronics Co., LtdInventors: Jin-Won Lee, Kyoung-Il Park, Sun-Hong Kim, Min-Sik Kim, Ji-Na Lee
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Patent number: D605609Type: GrantFiled: November 21, 2008Date of Patent: December 8, 2009Assignee: Alti-Electronics Co., LtdInventors: Jin-Won Lee, Kyoung-Il Park, Sun-Hong Kim, Min-Sik Kim, Ji-Na Lee
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Patent number: D606031Type: GrantFiled: September 9, 2008Date of Patent: December 15, 2009Assignee: Alti-Electronics Co., Ltd.Inventors: Gwui-Youn Park, Chi-Ok In
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Patent number: D606032Type: GrantFiled: November 21, 2008Date of Patent: December 15, 2009Assignee: Alti-Electronics Co., Ltd.Inventors: Jin-Won Lee, Kyoung-Il Park, Sun-Hong Kim, Min-Sik Kim, Ji-Na Lee
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Patent number: D607421Type: GrantFiled: November 25, 2008Date of Patent: January 5, 2010Assignee: Alti-Electronics Co., LtdInventors: Gwui-Youn Park, Chi-Ok In, Hyun-Ho Shin
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Patent number: D609200Type: GrantFiled: August 18, 2008Date of Patent: February 2, 2010Assignee: Alti-Electronics Co., Ltd.Inventor: Dong-Soo Kim
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Patent number: D614591Type: GrantFiled: November 25, 2008Date of Patent: April 27, 2010Assignee: Alti-Electronics Co., LtdInventors: Gwui-Youn Park, Chi-Ok In, Hyun-Ho Shin