Abstract: A manufacturing method of a flip chip package structure is provided and has following steps: providing at least one silicon substrate having a connecting surface and at least one conductive base attached to the connecting surface; arranging a graphene copper layer covering the conductive base; laminating a photoresist layer on the connecting surface, etching the photoresist layer to form a cavity corresponding to the conductive base, and a portion of the graphene copper layer corresponding to the conductive base being exposed on a bottom of the cavity; electroplating a copper material on the graphene copper layer, and the copper material being accumulated in the cavity to form a copper pillar; removing the photoresist layer and the graphene copper layer covered by the photoresist layer.

Abstract: A graphene modifying method of metal having following steps of providing metal powders, graphene powders and a binder, the metal powder has metal particles, and the graphene powder has graphene micro pieces, each graphene micro piece is formed by 6-atom unit cells connected with each other, each 6-atom unit cell is connected to a stearic acid functional group by a sp3 bond; mixing the metal powder, the graphene powder, and the binder to generate heat by a friction, each sp3 bond connected with the stearic acid functional group is thereby heated and broken, each 6-atom unit cell is connected with other 6-atom unit cells via the broken sp3 bond, and the metal particles are thereby wrapped by the 6-atom unit cells; and sintering the metal particles into a metal body to transform the plurality of graphene micro pieces into a three-dimensional mash embedded in the metal body.