Patents Assigned to Amkor Technology Japan, Inc.
-
Patent number: 11967565Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: June 13, 2022Date of Patent: April 23, 2024Assignee: Amkor Technology Japan, Inc.Inventors: Takahiro Yada, Tsukasa Takaiwa
-
Publication number: 20230111868Abstract: There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the substrate, and a heat sink bonded to the semiconductor chip via a thermal interface material and fixed to the substrate outside the semiconductor chip, in which the heat sink has a protrusion part protruding toward the substrate and bonded to the substrate via a conductive resin between a part bonded to semiconductor chip and a part fixed to the substrate and the heat sink has a stress absorbing part. According to the present invention, the protrusion part of the heat sink is prevented from being peeled off from the substrate at the part where the protrusion part of the heat sink is bonded to the substrate.Type: ApplicationFiled: October 31, 2022Publication date: April 13, 2023Applicant: Amkor Technology Japan, Inc.Inventor: Masao HIROBE
-
Publication number: 20220384284Abstract: In one example, a semiconductor device comprises a cavity substrate comprising a base and a sidewall to define a cavity, an electronic component on a top side of the base in the cavity, a lid over the cavity and over the sidewall, and a valve to provide access to the cavity, wherein the valve has a plug to provide a seal between a cavity environment and an exterior environment outside the cavity. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 17, 2022Publication date: December 1, 2022Applicant: Amkor Technology Japan, Inc.Inventors: Shojiro Hanada, Shingo Nakamura
-
Publication number: 20220375873Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 13, 2022Publication date: November 24, 2022Applicant: Amkor Technology Japan, Inc.Inventors: Takahiro YADA, Tsukasa TAKAIWA
-
Patent number: 11488886Abstract: There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the substrate, and a heat sink bonded to the semiconductor chip via a thermal interface material and fixed to the substrate outside the semiconductor chip, in which the heat sink has a protrusion part protruding toward the substrate and bonded to the substrate via a conductive resin between a part bonded to semiconductor chip and a part fixed to the substrate and the heat sink has a stress absorbing part. According to the present invention, the protrusion part of the heat sink is prevented from being peeled off from the substrate at the part where the protrusion part of the heat sink is bonded to the substrate.Type: GrantFiled: October 3, 2019Date of Patent: November 1, 2022Assignee: Amkor Technology Japan, Inc.Inventor: Masao Hirobe
-
Publication number: 20220254704Abstract: A semiconductor package includes a die pad; a plurality of external connection terminals located around the die pad; a semiconductor chip located on a top surface of the die pad and electrically connected with the plurality of external connection terminals; and a sealing member covering the die pad, the plurality of external connection terminals and the semiconductor chip and exposing an outer terminal of each of the plurality of external connection terminals. A side surface of the outer terminal of each of the plurality of external connection terminals includes a first area, and the first area is plated.Type: ApplicationFiled: April 26, 2022Publication date: August 11, 2022Applicant: Amkor Technology Japan, Inc.Inventor: Masafumi SUZUHARA
-
Patent number: 11367664Abstract: In one example, a semiconductor device comprises a cavity substrate comprising a base and a sidewall to define a cavity, an electronic component on a top side of the base in the cavity, a lid over the cavity and over the sidewall, and a valve to provide access to the cavity, wherein the valve has a plug to provide a seal between a cavity environment and an exterior environment outside the cavity. Other examples and related methods are also disclosed herein.Type: GrantFiled: December 19, 2019Date of Patent: June 21, 2022Assignee: Amkor Technology Japan, Inc.Inventors: Shojiro Hanada, Shingo Nakamura
-
Patent number: 11362041Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: December 19, 2019Date of Patent: June 14, 2022Assignee: Amkor Technology Japan, Inc.Inventors: Takahiro Yada, Tsukasa Takaiwa