Patents Assigned to AMP (Japan), Ltd.
  • Patent number: 6478596
    Abstract: A semiconductor component mounting apparatus for mounting a semiconductor component to test the electric characteristics of the semiconductor component, comprising: a contactor 20 with which the semiconductor component contacts; a substrate 30 which supplies an electric signal to the contractor 20; a plurality of connection components 40, each of which has an electric terminal 48 for supplying the electric signal to the substrate 30 and which is fixed to the substrate 30; a plurality of connectors 50 which has a contact pin 70 including a contact part 74 for contacting with the electric terminal 48 of the connection component 40, a housing 68 for holding the contact pin 70, a pushing apart 78 for pushing the contact pin 70 to the electric terminal 48, and which is freely-detachably connected to one of the plurality of the connection components 40; a holder 80 which holds the plurality of the connectors 50; and a fixing part 86 which fixes the holder 80 to the substrate 30, wherein the contact part 74 slides a
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: November 12, 2002
    Assignees: Advantest Corporation, AMP (Japan) Ltd. I
    Inventors: Kenji Yoshida, Takashi Naito, Shigeru Murayama, Katsuhiko Sakamoto, Takashi Masaki
  • Patent number: 6390860
    Abstract: A connector includes a vibration preventing piece is provided on the side surface of a connecting section between an elongated tab-shaped contact section provided at one end of a connecting terminal and a locking section at the middle, in such a manner that it is flush with the side surface of the locking section and extended towards the tab-shaped contact section. A contact recess is formed in the contact section engaging hole which is formed in the contact section engaging hole which is formed in a housing, so that, when the connecting terminal is inserted into the terminal accommodating chamber, the vibration preventing piece of the connecting terminal is abutted against the contact recess in the contact engaging hole.
    Type: Grant
    Filed: October 15, 1999
    Date of Patent: May 21, 2002
    Assignees: Yazaki Corporation, AMP (Japan), Ltd.
    Inventors: Kouichi Shirouzu, Kei Sato, Satoru Shindoh, Hidehisa Yamagami
  • Patent number: 6305976
    Abstract: An electrical connector (1) for circuit board installation is provided using solder pegs (60) to reduce the mounting area. Mounting holes (40) for insertion of solder pegs (60) are provided, along the side walls (36), on both sides of the housing (2) of the electrical connector (1) to be installed on a circuit board (30). The mounting holes (40) are formed perpendicular to the circuit board (30), from the top wall (18) of the housing (2) toward the bottom wall (34). The mounting holes (40) are connected to the mating aperture (6) of the connector (1), and are opened to the outside via the bottom part of the side walls (36). When the solder pegs (60) are inserted into the mounting holes (40) and the connectors are mated, a mating connector is guided by a solder peg face (61) of the solder pegs (60).
    Type: Grant
    Filed: April 7, 2000
    Date of Patent: October 23, 2001
    Assignee: AMP (Japan), Ltd.
    Inventors: Junya Tsuji, Takashi Futatsugi
  • Patent number: 5213515
    Abstract: An electrical connector includes a housing (12) having a horizontal mounting surface (14) and a plurality of closely spaced contacts (25, 26) with portions (25c, 26c) that are solderable to the conductive traces on a printed circuit board surface. A separable plate (30) is affixed to the housing and includes channels (32) receiving the portions (25c, 26c) to precisely position such portions for soldering to the board traces. Member (30) can be thereafter removed from housing (12) to allow full inspection of the solder joints formed during the soldering operation.
    Type: Grant
    Filed: January 15, 1992
    Date of Patent: May 25, 1993
    Assignee: AMP (Japan) Ltd.
    Inventors: Shigeru Ishikawa, Yoshitsugu Fujiura