Patents Assigned to AMPAK TECHNOLOGY INC.
  • Patent number: 11962060
    Abstract: A power dividing and combining device comprising a resonance body, a plurality of circuit boards, an upper cover and a lower cover is provided. The resonance body comprises a solid conductive body, a plurality of first dividing elements, a plurality of second dividing elements, a signal-receiving end and a signal-transmitting end. The solid conductive body has a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connecting the first surface and the second surface. The first dividing elements are disposed on the first surface and separate a plurality of first resonance channels on the first surface. The first resonance channels intersect at a first common region on the first surface. The second dividing elements are disposed on the second surface and separate a plurality of second resonance channels on the second surface. The second resonance channels intersect at a second common region on the second surface.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: April 16, 2024
    Assignee: AMPAK TECHNOLOGY INC.
    Inventors: Fure-Tzahn Tsai, Ruey Bing Hwang, Tso Hua Lin, Chih Wei Wang, Tzong-Yow Ho