Patents Assigned to Antares Advanced Test Technologies, Inc.
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Publication number: 20090321901Abstract: According to example embodiments, a device configured to dissipate heat from a first chip and a second chip on a multi-chip package includes a primary heat sink configured to contact an upper surface of the first chip, a secondary heat sink configured to contact an upper surface of the second chip, the secondary heat sink disposed within the primary heat sink and movable in relation to the primary heat sink, and a thermally conductive substance disposed in contact with the primary heat sink and the secondary heat sink.Type: ApplicationFiled: June 25, 2008Publication date: December 31, 2009Applicant: ANTARES ADVANCED TEST TECHNOLOGIES, INC.Inventors: Chris Lopez, Brian L. Hahn, Sudhir Kumar, Trevor J. Moody
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Publication number: 20090261851Abstract: According to some example embodiments, an interconnect has a crown with contact tips, in which each of the contact tips is structured to physically contact a substantially spherical solder ball along a curved inner surface of the contact tip.Type: ApplicationFiled: April 18, 2008Publication date: October 22, 2009Applicant: ANTARES ADVANCED TEST TECHNOLOGIES, INC.Inventors: Jiachun Zhou, Praveen Matlapudi
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Publication number: 20090237097Abstract: According to an example embodiment, a contact cell includes a first element that is flexible and electrically conductive, and that is structured to have at least one bend along an entire length of the first element. The contact cell further includes a second element that is flexible and electrically conductive, and that is structured to have at least one bend along an entire length of the second element. The contact cell further includes a tie that is electrically non-conductive, and that is affixed to the first element and affixed to the second element such that the first element and second element are physically and electrically separated from each other.Type: ApplicationFiled: March 24, 2008Publication date: September 24, 2009Applicant: ANTARES ADVANCED TEST TECHNOLOGIES, INC., a Washington corporationInventors: ILAVARASAN M. PALANIAPPA, KANAPATHIPILLAI PRABAKARAN
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Patent number: 7402051Abstract: An interconnect assembly is provided for electrically connecting first and second circuit members. Each of the circuit members comprises an array of electrical contacts. The interconnect assembly includes a plurality of compressible electrical conductors having opposite ends respectively configured for contacting the electrical contacts of the first and second circuit members. The interconnect assembly also includes a carrier defining a plurality of apertures for receiving the conductors and at least one retainer contacting each conductor. Each of the retainers has a maximum diameter that is greater than a minimum diameter of the apertures such that a portion of each conductor is retained within one of the apertures.Type: GrantFiled: November 10, 2006Date of Patent: July 22, 2008Assignee: Antares Advanced Test Technologies, Inc.Inventors: Rakesh Batish, Richard M. Pointer
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Patent number: 7297004Abstract: An electrical conductor comprises a compressible conductive member and a tubular conductive sleeve, wherein the sleeve includes an internal deformation. The compressible member comprises a tubular lattice of interlaced wires received axially within the sleeve and engaged therein by the internal deformation to retain the compressible member axially within the sleeve.Type: GrantFiled: February 6, 2007Date of Patent: November 20, 2007Assignee: Antares Advanced Test Technologies, Inc.Inventors: John M. Shuhart, Timothy L. Kraynak
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Patent number: 7217139Abstract: An interconnect assembly for providing electrical interconnection between elements of a probe card assembly is provided. The interconnect assembly includes a frame defining a plurality of openings and a plurality of conductive contacts coupled to the frame. Each of the conductive contacts includes (a) a first resilient arm extending away from a first surface of the frame and (b) a second resilient arm extending away from a second surface of the frame. At least one of the first resilient arm or the second resilient arm extends through one of the plurality of openings.Type: GrantFiled: August 8, 2005Date of Patent: May 15, 2007Assignee: Antares Advanced Test Technologies, Inc.Inventors: Jim Jaquette, Gene Tokraks, Steve Fahrner