Abstract: An overlay metrology mark for determining the relative position between two or more layers of an integrated circuit structure comprising a first mark portion associated with and in particular developed on a first layer and a second mark portion associated with and in particular developed on a second layer, wherein the first and second mark portions together constitute, when the mark is properly aligned, at least one pair of test zones, each test zone comprising a first mark section formed as part of the first mark portion and a second mark section formed as part of the second mark portion each comprising a plurality of elongate rectangular mark structures in parallel array adjacently disposed to form the said test zone such that the mark structures in each test zone are in alignment in a first direction within the test zone but are substantially at 90° with respect to the mark structures of at least one other test zone in alignment in a second direction, and wherein the test zones making up the or each pair a

Abstract: A method of automatically focusing a microscope having a light source, an objective lens or lens system, a means to direct incident light through the objective lens or lens system to be reflected by the object, an aperture to limit the spatial extent of the incident light and serve as an illumination pupil, a means to direct at least some of the reflected light to an imaging system, and an imaging system to image the reflected light so directed is described.

Abstract: A method and apparatus for the detection and classification defects in a silicon or semi-conductor structure, in particular using room temperature photoluminescence effects, is described. The method involves directing a high intensity beam of light at a surface of a sample of silicon or semi-conductor structure to be tested producing a photoluminescence image, producing a reflected light image, combining the information in the two images to detect, map and identify and/or characterize micro-defects in the silicon or semi-conductor structure.

Abstract: A sealing ring assembly and an improved method for mounting a sealing ring into an electrochemical cell used for Electrochemical Capacitance Voltage (ECV) profiling measurements. The ring is located in a holder having at least one secondary bore providing fluid communication between a forward face of the holder and the central bore of the ring, directed parallel to but tangentially offset relative to the inner wall of the central bore so as to impart a degree of rotational flow to electrolyte entering the sealing ring through the or each secondary bore which effectively removes gas bubbles and refreshes the electrolyte. The holder facilitates ring removal with a much reduced risk of damage to the delicate sealing surface.

Abstract: A method for detecting surface or near surface metal contamination in a semiconductor or silicon structure is described in which the structure or a part thereof is exposed to an excitation beam of predetermined wavelength and collecting luminescence from the structure in as the form of PL map having a substantially uniform PL intensity level provided by the semiconductor; and inspecting the map for one or more regions of enhanced PL intensity identifying characteristic surface or near surface metal contamination. In particular, the method is applied as an in-process quality control or as a quality control of processed structures such as interconnects.

Abstract: For determining the dependence of a first measuring quantity (Y) on a second measuring quantity (P) the second measuring quantity (P) is periodically modified with a frequency (f0). The first measuring quantity (Y) changing accordingly is measured. From the obtained measuring signal of the first measuring quantity (Y) the components of the first measuring quantity (Y) are determined with at least a plurality of frequencies. From the components thus determined the first measuring quantity (Y) is reconstructed for at least a plurality of values of the second measuring quantity (P) by signal processing.

Abstract: The invention relates to a novel housing for an optical instrument such as a microscope. The housing is provided with a number of channel means which are positioned having regard to the optical axis of the instrument and adapted to accommodate a plurality of optical components so as to facilitate the alignment of same.