Patents Assigned to Apic Corporation
  • Patent number: 9653639
    Abstract: The subject matter disclosed herein relates to formation of silicon germanium devices with tensile strain. Tensile strain applied to a silicon germanium device in fabrication may improve performance of a silicon germanium laser or light detector.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: May 16, 2017
    Assignee: Apic Corporation
    Inventor: Birendra Dutt
  • Patent number: 9149805
    Abstract: A microfluidic fluid separator for separating target components of a fluid by filtration is described. Methods for separating target components of a fluid by filtration and methods for processing blood on a large scale with the microfluidic fluid separator are provided.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: October 6, 2015
    Assignees: UNIVERSITY OF SOUTHERN CALIFORNIA, APIC CORPORATION, CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: Emil P. Kartalov, Axel Scherer, Koichi Sayano
  • Publication number: 20140270621
    Abstract: The subject matter disclosed herein relates to a photonic module comprising: a plurality of metal pads to receive CMOS integrated circuit (IC) chips to be mounted on a silicon-on-insulator (SOI) wafer; electrical interface circuits to receive electrical signals from the CMOS IC chips and to modify the electrical signals; optical drivers to receive the modified electrical signals and to convert the modified electrical signals to optical signals; and a photonic layer on the SOI wafer comprising silicon optical waveguides and silica optical waveguides to transmit or receive the optical signals for communication among the CMOS IC chips.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: APIC CORPORATION
    Inventors: Birendra Dutt, Ashok Kumar Kapoor
  • Publication number: 20140270629
    Abstract: The subject matter disclosed herein relates to a photonic module comprising: a silicon-on-insulator (SOI) wafer; one or more photonic components on the SOI wafer; a plurality of metal pads to receive integrated circuit (IC) chips to be mounted on the SOI wafer; silicon optical waveguides to transfer optical signals among terminals of individual the IC chips, wherein the silicon optical waveguides comprise portions of the SOI wafer; and silica optical waveguides to transfer optical signals among terminals of different the IC chips.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: APIC Corporation
    Inventors: Birendra Dutt, Ashok Kumar Kapoor
  • Publication number: 20130202005
    Abstract: The subject matter disclosed herein relates to formation of silicon germanium devices with tensile strain. Tensile strain applied to a silicon germanium device in fabrication may improve performance of a silicon germanium laser or light detector.
    Type: Application
    Filed: February 7, 2012
    Publication date: August 8, 2013
    Applicant: APIC Corporation
    Inventor: Birendra Dutt
  • Patent number: 8480978
    Abstract: A microfluidic fluid separator for separating target components of a fluid by filtration is described. Methods for separating target components of a fluid by filtration and methods for processing blood on a large scale with the microfluidic fluid separator are provided.
    Type: Grant
    Filed: August 9, 2011
    Date of Patent: July 9, 2013
    Assignees: University of Southern California, APIC Corporation, California Institute of Technology
    Inventors: Emil P. Kartalov, Axel Scherer, Koichi Sayano
  • Patent number: 7215845
    Abstract: An optical interconnect architecture provides three dimensional optical interconnects, with the optical interconnects provided along a plane such as a wafer or a substrate. One or more integrated circuits is provided on a second “electronic” plane that is spaced from the optical interconnect plane. Signals from the circuit on the electronic plane are coupled to the optical interconnect plane using various strategies, including metal or optical interlayer interconnects extending perpendicular to the optical plane. Once on the optical interconnect plane, the signals from the circuits on the electronic plane are propagated optically.
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: May 8, 2007
    Assignee: Apic Corporation
    Inventors: James K. Chan, Birendra Dutt
  • Patent number: 6594409
    Abstract: An optical component is formed on a silicon on insulator (SOI) substrate and has an array waveguide that demultiplexes an input light signal into N channels and provides that light signal to a corresponding set of N waveguide structures formed on a surface of the SOI substrate. The N waveguide structures provide the N channels of light to N optical detectors. Each optical detector is bonded to a surface of a corresponding one of the waveguide structures. The N channels of light pass through the N waveguide structures and are coupled into the N optical detectors so that light from a corresponding channel of the array waveguide is coupled into a corresponding optical detector and converted into an electrical signal.
    Type: Grant
    Filed: April 18, 2001
    Date of Patent: July 15, 2003
    Assignee: APIC Corporation
    Inventors: Birendra Dutt, James Chan