Abstract: The invention provides a treating process and system using a chemical treating liquid, which enables uniform treatments to be carried out within a reduced period of time. A heating tube is used to heat a fluid passing therethrough by irradiation of the fluid with microwaves. A pressurizer is provided upstream of the heating tube, and a throttle valve is provided downstream of the heating tube, so that the boiling of the fluid is prevented by activating the pressurizer to increase the internal pressure of the heating tube. A mixer comprising opposite nozzles is provided to jet fluids from the nozzles for collision with each other, so that the fluids are uniformly mixed. The treating process and system are suitable for semiconductor unit production.

Abstract: An apparatus and method for transferring a particulate material in a non-contact manner. The apparatus has a driving device including a nozzle curved surface portion fitted to the transfer pipe to join with the inner wall surface of the pipe. The nozzle curved surface portion has a curved surface whose diameter continuously increases from the inner wall surface. The driving device further includes an annular gap-forming member that forms a nozzle gap between it and the nozzle curved surface portion. A fluid is caused to flow into the transfer pipe from the driving device, thereby forming a buffer layer of a spiral flow in the vicinity of the inner wall surface of the transfer pipe and thus keeping the particulate material in a non-contact state.