Abstract: Encapsulated integrated circuits (chips) (2, 3, 4, 5, 6) are manufactured by separating the encapsulated integrated circuits arranged on a lead frame (1), subsequently cutting away the lead-connecting strips (7) of the individual products, then bending the leads and finally cutting them to length. By subjecting the products individually to the above stated method steps, products in a great variety of dimensions can be processed. The method and device according to the invention are particularly suitable for manufacturing pilot series on laboratory scale.

Abstract: A system of machining lead frames (7), such as punching, cutting and bending of the leads consists of a number of machining devices (1, 2, 3) placed in series. Transport means (8) are provided for transporting the lead frames between the successive machining device. Each device comprises means for transporting the lead frames in horizontal and vertical direction, a tool carrier driving means for driving the tool carrier (18). Further, a control device (4) is provided for controlling, synchronizing and protecting the operation of the machining devices. The machining devices are purely mechanically driven and the system is a device on a modular basis.

Abstract: An apparatus for molding electronic components. The single-strip molding apparatus has a mold die formed from two mold halves which are movable relative to each other and can be closed upon one another. A leadframe for the component to be molded is placed into a recess in one of the mold halves. Molding material is heated and forced under pressure into the recess containing the leadframe. After the component is molded the mold is opened and the upper half of the mold is cleaned by a combined cleaning-discharge unit. Upon the return stroke of the cleaning-discharge unit, the molded component is removed and the lower half of the mold is cleaned.

Abstract: An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are recirculatingly moved through the system for repeated usage.

Abstract: An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are recirculatingly moved through the system for repeated usage.

Abstract: A receiving and arranging apparatus for bringing electronic components, or other workpieces, into a molding apparatus and unloading them from suitable magazines into a mechanism which arranges them in a proper orientation for placement into a mold. The apparatus includes a vertically movable and horizontally rotatable turntable mechanism which operates in conjunction with a conveyor system to arrange the electronic components in a side by side manner for transfer to a subsequent workstation in the molding process.

Abstract: A lead frame for applying micro-electronic elements thereon, which lead frame comprises a series of lead patterns disposed at mutually equal pitch distances, each consisting of a carrier plate lying on the axis of the frame for applying a micro-electronic element thereto, further of leads terminating a short distance from said carrier plate, said leads being connected to lands extending perpendicularly to the frame axis and disposed on either side of the carrier plate, said leads extending beyond said lands in mutually parallel relationship so as to form lead terminals, as far as the next land of the adjoining lead pattern and being connected thereto, while the parallel leads of adjoining patterns are shifted relatively to each other in transverse direction: the mutual distance between two lands associated with one lead pattern is equal to the width of the standardized resin envelope of the micro-electronic element, the lands being provided with cuts in a direction approximately parallel to the axis of the le

Abstract: A method and apparatus for cold runner transfer molding. Insulating and/or cooling means are provided so that the mold runnerblock is kept sufficiently cool to prevent curing of the plastic molding compound therein. By the addition of a plunger near the gate of the mold, a quasi-continuous molding operation may be effected. Local preheating of the molding material at the gate locale may be used to liquefy a feedstock which has travelled through the cold-runners in powdered form.

Abstract: An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are recirculatingly moved through the system for repeated usage.

Abstract: An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are recirculatingly moved through the system for repeated usage.

Abstract: Apparatus is provided for bending one or two complete rows of leads on a dual-in-line semiconductor package at one time without damaging the leads. The leads of the dual-in-line package are initially in their manufactured position, extending horizontally from the sides of the package and generally parallel to the top and bottom surface thereof. A support anvil is placed under the portion of the lead which is sealed in the semiconductor package, and a punch or bending member is disposed immediately adjacent the outside edge of the handle for performing the actual bending. A sheet of relatively thin metal is formed into a U-shaped channel and the bending member inserted therein before lowering so that as the bending member is lowered, no portion thereof touches the surface of the leads being bent. The sheet of thin metal buffers the bending operation and is interposed between the bottom and side of the bending member and the face of the leads for preventing scratching or damage thereto.

Abstract: A method and apparatus for cleaning at least selected surfaces of a mold apparatus to remove plastic residue and surface contaminates and impurities to enable the molds to be used in a continuous in-line type process for encapsulating lead frame assemblies or similar semi-conductor circuits. After the molds are separated and the large pieces of excess plastic are broken away, they are transported to a vacuum chamber and electrically coupled as, or at least proximate, the cathode. The vacuum chamber is evacuated and an inert ionizable gas such as argon is admitted. An electrical field is established between the anode and cathode to create a plasma or glow discharge causing the gas to ionize. The positive ions are accelerated by the electrical field toward the cathode and bombard at least selected areas of the mold portion to be cleaned for removing surface contaminates and producing an extremely clean surface to enable the mold portion to be used again and again in a continuous cyclical or in-line process.