Abstract: The present invention relates to an apparatus for transferring electronic devices from a holding unit to a processing station. The apparatus comprises first and second rotating mechanisms having a plurality of handlers and a plurality of holders respectively, an imaging mechanism, a processor and an adjusting mechanism. In use, a handler retrieves an electronic device from the holding unit and moves the device to a transfer position. A holder retrieves the electronic device from the handler at the transfer position and transfers the electronic device to the processing station. Prior to this retrieval, the adjusting mechanism adjusts a relative position between the holder and the handler at the transfer position. This adjustment is based on offsets calculated by the processor using images of the handler and holder captured by the imaging mechanism. The adjustment allows the electronic device to be retrieved more securely by the holder.

Abstract: A method, as well as a system implementing the method, for automatically aligning a bond arm with respect to a bonding support surface for supporting a substrate during a bonding process. The method comprises: rotating the bond arm for a first revolution around a longitudinal axis through a bond head moveably coupled to the bond arm, the first revolution including a plurality of predefined rotary angular positions; pausing the rotation of the bond arm at each of the plurality of rotary angular positions; determining a tilt angle of the bond arm relative to the bonding support surface during each pause at the respective rotary angular position; and selecting the rotary angular position of the bond arm which has a tilt angle that satisfies a predefined specification such that the bond arm is aligned substantially perpendicular to the bonding support surface.

Abstract: An apparatus for inspecting a surface of an object has a first light source operative to illuminate the object without producing a patterned image onto the object. A second light source projects a patterned image produced from a first polarized light from the second light source onto the object, wherein the first polarized light is polarized in a first polarization direction. A third light source projects the patterned image produced from a second polarized light from the third light source onto the object, wherein the second polarized light is polarized in a second polarization direction different from the first polarization direction. An imaging device views the surface of the object when the object is illuminated separately by the first, second and third light sources respectively for determining a profile of the surface of the object.

Abstract: A method of bonding a die comprising solder bumps to a substrate comprising bond pads, the method comprising the steps of heating the die from a first temperature to a second temperature, wherein the first temperature is below the melting point of the solder bumps, and the second temperature is above the melting point of the solder bumps; moving the die relative to the substrate to a first height, whereat the solder bumps contact the bond pads; moving the die further away from the substrate to a second height, while maintaining contact between the solder bumps and bond pads; and thereafter cooling the die from the second temperature to a third temperature to allow the solder bumps to solidify so as to bond the die to the substrate.

Abstract: A semiconductor die pick and place device comprising a handing mechanism comprising a pick arm movable between a placement location and a pick-up location. A reference feature is located on the pick arm, and a light reflecting module is carried by the pick arm. The light reflecting module is operable to reflect an image of the reference feature to an image capturing module such that the reference feature appears to the light reflecting module to be in focus at a virtual position that is equivalent to a position at the pick-up location and/or the placement location.

Abstract: The invention provides a light emitting diode device that comprises a light emitting diode die. The method for manufacturing the light emitting diode device comprises positioning a first stencil over a carrier, printing a phosphor material onto the carrier through at least one aperture of the first stencil to form a phosphor material piece on the carrier, and attaching the light emitting diode die onto the printed phosphor material piece.

Abstract: A die tester comprising a testing table on which a plurality of dice arranged in an array are mountable, and a first probe and a second probe that are adjustable to a fixed position with a fixed separation distance between the first probe and the second probe. The fixed position corresponds to predetermined test points on the plurality of dice, and the testing table and the first and second probes are movable relative to each other so as to position test points of a first die of the plurality of dice to the first probe and the second probe for testing the first die. The die tester further comprises movable third and fourth probes that are movable relative to each other and positionable to test points on a second die of the plurality of dice for testing the second die.

Abstract: A semiconductor encapsulation apparatus for encapsulating a semiconductor device on a substrate, the apparatus comprising a mold comprising a cavity pressure zone that is configured to be at a molding process pressure during molding, a base vacuum pump conduit connecting a base vacuum pump to the cavity pressure zone, a base vacuum valve located along the base vacuum pump conduit such that the base vacuum pump is in fluid communication with the cavity pressure zone when the base vacuum valve is open, a reservoir vacuum pump conduit connecting a reservoir vacuum pump to the base vacuum pump conduit, and a reservoir vacuum valve located along the reservoir vacuum pump conduit such that the reservoir vacuum pump is in fluid communication with the base vacuum pump conduit when the reservoir vacuum valve is open.

Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.

Abstract: The invention provides a method of bonding wire between first and second bonding points with a bonding tool. It comprises the steps of forming a first bond at the first bonding point with the bonding tool, forming a first kink located over the first bond, and moving the bonding tool to a first position spaced from the first kink by a predetermined distance to release a length of wire from the bonding tool. It further comprises the step of moving the bonding tool in a direction away from the second bonding point to a second position which is outside a plane comprising the first bonding point, the second bonding point, and the first kink. It also comprises the steps of forming a second kink which lies outside the plane, and moving the bonding tool to the second bonding point to form a second bond.

Abstract: A feeding apparatus for supplying electronic devices for pick-up comprises a guide track for guiding and feeding a plurality of electronic devices and a separator operative to receive electronic devices from the guide track for the electronic devices to be picked up from the separator. A protrusion is located on either of the guide track or the separator, and a cavity is located on the other of the guide track or the separator for receiving the protrusion. The protrusion and the cavity cooperate to form a substantially continuous surface for transferring the electronic devices to the separator.

Abstract: A lead frame comprises a substrate comprising copper and includes a layer of bright silver is plated onto the substrate. A layer of doped bright silver is thereafter plated over a top surface of the layer of bright silver for enhancing the performance of LED devices utilizing the lead frame.

Abstract: A semiconductor package testing apparatus comprises a package holder for holding a semiconductor package and which is positionable together with the semiconductor package at a test contactor station. There are probe pins located at the test contactor station for contacting a bottom surface of the semiconductor package and which are configured to apply an upwards force on the semiconductor package during testing of the semiconductor package. A restraining mechanism that is movable from a first position remote from the package holder and a second position over the package holder is configured to restrict lifting of the semiconductor package by the probe pins during testing of the semiconductor package when the restraining mechanism is at its second position.

Abstract: Disclosed is a method of manufacturing a lead frame, which comprises the steps of: providing an electrically-conductive base material having first and second planar sides; forming a plurality of conductive contact points on the first planar side of the base material; providing a non-conductive filling material over the first planar side of the base material so that the filling material fills spaces in-between the plurality of contact points to a form a layer comprising the filling material and the plurality of contact points; and etching the second planar side of the base material to expose a pattern of the filling material from the second planar side of the base material and to thereby form a plurality of isolated conductive regions on the second planar side of the base material, each isolated conductive region being connected with at least a respective one of the plurality of contact points on the first planar side of the base material. A lead frame structure is also disclosed.

Abstract: A method is described of radiatively cutting a wafer, the method comprising the steps of low power cutting of two trenches followed by high power cutting of a fissure. A single pulsed radiation beam is split into a first pulsed radiation beam for cutting at least one of the trenches and a second pulsed radiation beam for cutting the fissure. When cutting a fissure on the wafer in a cutting direction along a cutting street, the first and second radiation beams are directed simultaneously with the first radiation beam leading and the second radiation beam trailing. For cutting a fissure in the opposite cutting direction, a third pulsed radiation beam for trenching is split from said single pulsed radiation beam.

Abstract: An active vibration absorber is attachable to a structure incorporating a positioning system which serves to vibrate the structure during its operation. The active vibration absorber comprises a mounting portion for attachment to the structure, an inertial mass that is resiliently coupled to the mounting portion and a force actuator which is operative to controllably move the inertial mass relative to the mounting portion. The force actuator is configured to move the inertial mass relative to the mounting body according to a motion profile during a motion cycle of the positioning system in order to attenuate vibrations in the structure. The motion profile is determined from a motion command which is operative to drive the positioning system during the motion cycle.

Abstract: Method of generating a correction function for a light-emitting diode (LED) testing process, including: detecting light emitted by a reference LED and reflected from inactive LEDs on a panel within a field of view of a detector; varying a number of the inactive LEDs to derive uncorrected values of an optical parameter as a function of the number of inactive LEDs; detecting light emitted by the reference LED, or by an active LED having identical optical properties, in the absence of any other LEDs, to determine at least one reference value for each optical parameter; and calculating differences between the uncorrected values and each reference value to generate the correction function, the correction function being based on the number of inactive LEDs which are arranged within the field of view of the detector in the light detecting step.

Abstract: A wire bonding apparatus comprises an ultrasonic transducer including a capillary, a flexible connecting frame having a first side to which the ultrasonic transducer is connected and at least one electrically-driven actuator which is connected to a second side of the flexible connecting frame that is opposite to the first side thereof, the actuator having a longitudinal actuation direction. An elongated slit located in the flexible connecting frame extends substantially transversely to the actuation direction of the at least one actuator to form at least one pivot point adjacent to an end of the slit about which the flexible connecting frame is rotatable when it is driven by the at least one actuator.

Abstract: A test handler comprises an orientation changing device having a device holder for holding electronic devices, the device holder having a vertical rotary axis. A conveying device is operative to convey electronic devices to the device holder, and a rotary motor connected to the device holder is operative to rotate the device holder about the vertical rotary axis to change an orientation of the electronic device held on it. A rotary turret of the test handler has a plurality of pick heads arranged on the rotary turret, and each pick head is configured to pick up electronic devices from the device holder.

Abstract: Disclosed is a leakage detection system (200) and a leakage detection method for detecting leakage in a gas supply system (10?) comprising a gas source (11; 12) connected to a gas delivery module (14) by a pipeline. The leakage detection system (200) comprises a flow meter (113) connectable along the pipeline remotely from an inlet of the gas delivery module (14); and a detection module (110) configured to receive signals representing a measured flow rate from the flow meter (113), and to compare the measured flow rate (115) to a stored leakage-free reference value (116) to detect an increase in flow rate in the presence of a leak. A flow resistance between the detection module (110) and an outlet of the gas delivery module (14) amplifies the increase in flow rate in the presence of a leak. The system (200) may comprise a flow rate elevation system (121) connectable between the gas source (11; 12) and the flow meter (113) for temporarily increasing the flow rate in the pipeline.