Abstract: An apparatus for removing and/or replacing a surface-mounted integrated circuit that includes electrical heating elements disposed in a planar rectangular array and a handle positioning the element array in heat-conductive contact with the legs on the side edges of a surface-mounted integrated circuit. When electrical energy is applied to the heating elements, the elements and the integrated circuit legs are heated so as to liquify the solder joints between the legs and the circuit board pads. An air pad is positioned within the heating element array for grasping and holding the integrated circuit to facilitate lifting of the circuit from the circuit board, or for holding a replacement integrated circuit on the circuit board, when all of the solder joints have been liquified.