Abstract: A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a non-uniform magnetic foil integrated in the stack.

Abstract: Provided is an electronic assembly including (a) an interconnect carrier having an electrically insulating core and at least two electrically conducting layers formed at the electrically insulating core; (b) a first integrated circuit chip mounted at a first side of the interconnect carrier; (c) a second integrated circuit chip mounted at a second side of the interconnect carrier opposite to the first side; and (d) an interconnection structure electrically connecting the first integrated circuit chip with the second integrated circuit chip. The electric interconnection structure extends around the insulating core and includes at least one electric conductor path which is designed in such a manner that an impedance match between the first integrated circuit chip and the second integrated circuit chip is provided. Further, there is provided an electronic system comprising such an electronic assembly.

Abstract: A component carrier with a stack including a plurality of electrically conductive layer structures and/or electrically insulating layer structures, and a first transistor component and a second transistor component embedded side-by-side in the stack.

Abstract: A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 ?m and a narrowest vertical thickness of the bridge structure is at least 20 ?m.

Abstract: A method of manufacturing a component carrier is disclosed. The method includes providing an electrically insulating layer structure having a front side and a back side, wherein the front side is covered by a first electrically conductive layer structure and the back side is covered by a second electrically conductive layer structure, carrying out a first opening process, such as a first laser drilling, through the first electrically conductive layer structure and into the electrically insulating layer structure from the front side to thereby form a blind hole in the electrically insulating layer structure, and thereafter carrying out a second opening process, such as a second laser drilling, through the second electrically conductive layer structure and through the electrically insulating layer structure from the back side to thereby extend the blind hole into a through hole, in particular a laser through hole, with substantially trapezoidal shape.

Abstract: The invention refers to a component carrier realized as a printed circuit board, an intermediate printed circuit board product or an IC-substrate, comprising at least one heat-passage component, said at least one heat-passage component being realized in form of a heat-generating or a heat-absorbing component that is mounted on an outside surface layer or is embedded within at least one inner layer of the component carrier, and further comprising at least one latent-heat storage unit with a phase-change material. The phase-change material is arranged within at least one cavity and integrated within a laminated build-up of the component carrier and is directly thermoconductively coupled with the at least one heat-passage component. The invention also refers to a method for producing said component carrier.

Abstract: A method of manufacturing a constituent for a component carrier is disclosed. The method includes providing an electrically conductive structure, forming a highly thermally conductive and electrically insulating or semiconductive structure on the electrically conductive structure, and subsequently, attaching a thermally conductive and electrically insulating structure, having a lower thermal conductivity than the highly thermally conductive and electrically insulating or semiconductive structure, on an exposed surface of the highly thermally conductive and electrically insulating or semiconductive structure.

Abstract: An electronic device and a method for transmitting electromagnetic radiation are disclosed. The electronic device includes (a) a component carrier with a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure; (b) a component embedded in the component carrier and configured for providing an electric radio frequency signal; (c) an antenna structure formed in the component carrier and configured for emitting electromagnetic radiation in response to receiving the provided electric radio frequency signal; and (d) a radiation lens formed in the component carrier and configured for spatially manipulating the emitted electromagnetic radiation and directing the spatially manipulated emitted electromagnetic radiation to an environment of the component carrier. Further described is an electronic device and a method for receiving electromagnetic radiation.

Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, at least one first electrically conductive track extending from a vertical level defined by one of the layer structures up to a first height, at least one second electrically conductive track extending from the vertical level defined by the one of the layer structures up to a second height being larger than the first height, and at least one further electrically insulating layer structure in which the at least one first electrically conductive track and the at least one second electrically conductive track are embedded.

Abstract: A connector device for connection with a counter piece for establishing a mechanical and electric connection, wherein the connector device comprises at least two printed circuit board elements each comprising an electrically insulating core and at least one comprising an electrically conductive structure at least partially on the respective electrically insulating core, and at least one embedded component embedded within the respective electrically insulating core and electrically coupled to the respective electrically conductive structure, wherein the at least one electrically conductive structure is arranged at least partially on an exposed surface of the connector device and is configured for establishing the electric connection with the counter piece upon establishing the mechanical connection with the counter piece.

Abstract: A method for manufacturing of a hybrid component carrier includes providing a first layer structure having at least one electrically insulating layer and at least one electrically conductive layer and forming a second layer structure on the first layer structure wherein the second layer structure has at least a first layer and a second layer. The first layer structure has a first density of electrically conductive elements. The second layer structure has a second density of electrically conductive elements. The second density of electrically conductive elements is greater than the first density of electrically conductive elements. The forming of the second layer structure on the first layer structure includes forming the first layer of the second layer structure on the first layer structure and subsequently forming the second layer of the second layer structure on the first layer of the second layer structure.

Abstract: A heat pipe (10) for cooling an electronic device, especially a component carrier (100), that comprises a central section (13) with a cavity (12) filled with a heat transfer fluid (20). In longitudinal direction (11) of the heat pipe (10) directly connected with the central section (13) are a first end section (14) on a first end of the central section and a second end section (15) on the opposite second end of the central section, wherein the first end section and the second end section each comprise a landing structure (17) with a surface length (SL, SL1, SL2) and a surface width (SW, SW1, SW2) and wherein each landing structure is thermoconductively coupled with the central section of the heat pipe. A component carrier comprising at least one heat pipe for cooling it, and a method for producing the component carrier are also provided.

Abstract: A manufacturing method of manufacturing a constituent for a component carrier, wherein the method comprises providing an electrically conductive structure, forming a highly thermally conductive and electrically insulating or semiconductive structure on the electrically conductive structure, subsequently, and attaching a thermally conductive and electrically insulating structure, having a lower thermal conductivity than the highly thermally conductive and electrically insulating or semiconductive structure, on an exposed surface of the highly thermally conductive and electrically insulating or semiconductive structure.

Abstract: The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.

Abstract: An inductor component includes a plurality of stacked layer structures made of component carrier material with electrically conductive plate structures, and a plurality of electrically conductive interconnect structures connecting the electrically conductive plate structures to thereby form an inductance with multiple windings.

Abstract: A manufacturing method, wherein the method includes providing a layer stack having at least partially uncured component carrier material, arranging a plurality of components in recesses of the layer stack, integrally connecting the components with the layer stack by curing the component carrier material, and applying a high temperature robust dielectric structure on a main surface of the cured layer stack with the components therein.

Abstract: A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps: providing a combination of the layers of the printed circuit board, or of the printed circuit board intermediate product, wherein this combination includes at least one curable prepreg material; creating a clearance in the combination for accommodating the component to be embedded; covering at least the region of the clearance with a first temporary carrier layer on a first side of the combination; positioning the component to be embedded in the clearance by way of the first temporary carrier layer; covering at least the region of the clearance on the second side of the combination with a second temporary carrier layer; compressing the combinatio

Abstract: A method of manufacturing a component carrier includes providing a known-good layer stack comprising an already formed electrically conductive connection structure and a known-good cavity, and mounting a known-good component on the already formed electrically conductive connection structure in the cavity.

Abstract: A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.

Abstract: A method and a sensor arrangement for determining a physical quantity are illustrated and described. The described method includes stimulating a capacitor device within a native component carrier; measuring a capacitance value of the capacitor device; and determining the physical quantity based on the measured capacitance value. Further described is a method for using a native component carrier as a transducer for detecting a value of a physical quantity.