Patents Assigned to AT&T IPM Corporation
  • Method for encapsulating electronic conductors
    Patent number: 5510153
    Abstract: Glass particles (14) are mixed within an uncured silicone resin (13). The fluid uncured resin is placed in a portion of a terminal block (11) and cured to form a gel (13') by subjecting it to microwaves in a microwave oven (22). Conductors (25, 26) to be interconnected are next inserted into the cured silicone gel and interconnected. The cured gel containing the glass particles thereafter constitutes a dependable insulator for the conductors, particularly the portions of the conductors that are interconnected.
    Type: Grant
    Filed: August 4, 1993
    Date of Patent: April 23, 1996
    Assignee: AT&T IPM Corporation
    Inventors: Peter F. Lilienthal, II, Ivan Pawlenko, Ching-Ping Wong