Patents Assigned to Auburn Univ. of the State of Alabama
  • Integrated circuit packaging and cooling
    Patent number: 4912600
    Abstract: A packaging and cooling structure for integrated circuit chips in electronic equipment is provided in which the chips are resiliently mounted on wafers which are centrally located in chambers within a housing. A liquid coolant is forced through orifices to spray the coolant on the wafers behind the chips and on the chips themselves providing both high velocity convective cooling and phase change boiling heat transfer. A temperature sensor and control are provided to sense and control the temperature within the electronic equipment.
    Type: Grant
    Filed: September 7, 1988
    Date of Patent: March 27, 1990
    Assignee: Auburn Univ. of the State of Alabama
    Inventors: Richard C. Jaeger, John S. Goodling, Norman V. Williamson