Abstract: A liquid cooling head device includes a base, a cover covering the base, an inlet portion disposed on the base, an outlet portion formed on the cover, and a fluid pump having a housing and a fan blade. The base includes a diversion channel, an opening and a first chamber connected to the diversion channel and the opening. A second chamber is formed between the cover and the base, and connected to the first chamber through the opening. The inlet portion is connected to the first chamber through the diversion channel. The housing covers one surface of the cover, so that a third chamber is collectively defined by the housing and the cover, and connected with the second chamber and the outlet portion. The fan blade is located in the third chamber, and the diversion channel is located between the fan blade and the first chamber.

Abstract: A coolant distribution unit includes a casing, a control module, a power supply module, a heat exchange module, and a fluid driving module. The power supply module is electrically connected to the control module, the fluid driving module is electrically connected to the control module and the power supply module, and the fluid driving module is in fluid communication with the heat exchange module. The control module, power supply module, heat exchange module, and fluid driving module are all arranged in the casing. In addition, the control module controls the power supply module to output a corresponding electrical power to the fluid driving module according to an operation status of the fluid driving module.

Abstract: A heat dissipation device includes two connected components and a flexible metal conduit. Each connected component is selected from a manifold, a quick connector, an evaporator, a condenser or a pump. The two connected components are in communication with each other through the flexible metal conduit. The use of the flexible metal conduit is effective to absorb the designing tolerance. In addition, the flexible metal conduit is recyclable.

Abstract: A water cooling head includes water cooling head includes a casing, a base and a pump. The casing includes an inlet and an outlet. An outer side of the base has a heat-absorbing surface. A thermal conduction structure is disposed on an inner side of the base. An active space is defined by the base and the casing collaboratively. The pump includes a first magnetic element, a second magnetic element, an impeller and a pivotal part. The first magnetic element is located outside the active space. The first magnetic element is arranged between the impeller and the base along a direction perpendicular to the base. The pivotal part, the second magnetic element and the impeller are disposed within the active space. The pivotal part is connected with the impeller and arranged between the impeller and the base. The second magnetic element is installed on the pivotal part.

Abstract: A water-cooling head includes a casing, a base, a thermal conduction structure and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The pump includes a fixing element, a shaft and an impeller. After the fixing element is fixed, the fixing element is contacted with the base or contacted with the thermal conduction structure, and the shaft is fixed on the fixing element. Consequently, the impeller is stably rotated about the shaft, and the performance and the reliability of the water-cooling head are enhanced.

Abstract: A heat exchanger includes a heat-absorbing part, two vapor conduits, a return conduit and a condensing part. The heat-absorbing part includes a vapor zone and a liquid zone. A first end of each vapor conduit is connected with the vapor zone of the heat-absorbing part. A first end of the return conduit is connected with the liquid zone of the heat-absorbing part. The condensing part includes a vapor-inputting chamber, a liquid-outputting chamber, a partition plate, a communication chamber, a first condenser tube group and a second condenser tube group. The vapor-inputting chamber is connected with a second end of each vapor conduit. The liquid-outputting chamber is connected with a second end of the return conduit. A loop is defined by the heat-absorbing part, the at least two vapor conduits, the return conduit and the condensing part collaboratively.

Abstract: A water-cooling head includes a casing, a base, an input channel, an output channel and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The heat absorbed by the base is transferred to the working medium. The input channel is in communication with the active space. The cooled working medium is introduced into the active space through the input channel. The output channel is in communication with the active space. The heated working medium is outputted from the active space through the output channel. The pump is installed on the casing, and includes an impeller. The impeller is disposed within the active space and located near the output channel. The impeller is driven to guide the working medium to be outputted from the active space through the output channel.

Abstract: A pump module includes a main body, a first pump and a second pump. The main body includes a fluid channel, a first mounting hole and a second mounting hole. The fluid channel is exposed through the first mounting hole and the second mounting hole. The first pump is installed in the first mounting hole and sealedly coupled with the first mounting hole. The second pump is installed in the second mounting hole and sealedly coupled with the second mounting hole. A working liquid in the fluid channel is transferred through the first pump and the second pump sequentially. Even if one of the first pump and the second pump is damaged, the other of the first pump and the second pump is normally operated to move the working liquid in the fluid channel.

Abstract: A composite-type heat pipe includes a working fluid, a first capillary structure, a second capillary structure and a pipe body. The first capillary structure has a smooth surface. The second capillary structure has plural trenches. The pipe body accommodates the working fluid. The pipe body includes a first section and a second section. The second section is connected with the first section. The first capillary structure is formed on a first inner wall of the first section. The second capillary structure with the trenches is formed on a second inner wall of the second section. The trenches extend along an axial direction of the pipe body.

Abstract: A rotatable water-cooling tube and an electronic device with the water-cooling tube are provided. The water-cooling tube includes a first tube body, a second tube body, a third tube body, a first connector and a second connector. The first tube body is in communication with the second tube body and the third tube body through the first connector and the second connector. The first tube body is rotatable with the first connector and the second connector. Consequently, the first tube body can be freely rotated to a proper position. The technology of the present invention is helpful to assemble and disassemble the heat generation component under the rotatable water-cooling tube.

Abstract: A heat dissipation system and a coolant distribution module for plural electronic components of an electronic computing device are provided. The heat dissipation system includes plural water-cooling heads, a heat dissipation device and the coolant distribution module. When a fluid medium flows through the heat dissipation device, the heat dissipation device exchanges heat with the fluid medium. The coolant distribution module is connected between the plural water-cooling heads and the heat dissipation device. The coolant distribution module includes a main body and a power module. The module main body includes a cooled fluid chamber. The cooled fluid chamber includes plural first outlets corresponding to the plural water-cooling heads. The power module is installed in the module main body. The power module drives the fluid medium to be outputted from the plural first outlets. Consequently, the fluid medium is transferred through a circulating loop.

Abstract: A water-cooling head includes a casing, an inclined flow-guiding structure and a bottom plate assembly. The casing includes an inlet and an outlet. A liquid is fed into the inlet. The inclined flow-guiding structure is disposed within the casing, and includes plural first openings. A bottom end of the inclined flow-guiding structure is located under the inlet. A top end of the inclined flow-guiding structure is arranged beside the outlet. The top end is located at a level higher than the bottom end. A second opening is formed in the bottom end. The bottom plate assembly is assembled with the casing, and located under the inclined flow-guiding structure. The bottom plate assembly includes a fin group. After the liquid is transferred to the fin group through the second opening or the plural first openings, the liquid is exited from the outlet.

Abstract: An electronic device with a heat-dissipating function and a liquid-cooling radiator module are provided. The electronic device includes a first circuit board, a second circuit board and a liquid-cooling radiator module. The second circuit board is mounted on the first circuit board. The liquid-cooling radiator module is attached on the second circuit board and in thermal contact with an electronic component of the second circuit board. The liquid-cooling radiator module includes plural airflow channels and a fan. The plural airflow channels are in parallel with the second circuit board. The fan produces airflow toward the plural airflow channel. After the airflow passes through the plural airflow channels, the airflow is outputted in a direction parallel with the second circuit board. Since the airflow is not obstructed by the adjacent function circuit boards, the heat-dissipating efficiency is enhanced.

Abstract: A clustered heat dissipation device and a chassis are provided. The clustered heat dissipation device includes a heat-absorbing manifold, plural heat-absorbing heads and plural connection pipes. The heat-absorbing manifold includes an inlet chamber and an outlet chamber. The inlet chamber includes at least one first liquid inlet and plural first liquid outlets. The outlet chamber includes plural second liquid inlets and at least one second liquid outlet. The heat-absorbing manifold is in thermal contact with a first heat source. The plural connection pipes are connected with the heat-absorbing heads and the corresponding first liquid outlets and connected with the heat-absorbing heads and the corresponding second liquid inlets.

Abstract: A heat dissipation device includes a first fin group, a second fin group, a heat pipe and a base. The base is in thermal contact with a heat source. The heat pipe includes a first pipe part and a second pipe part. The second pipe part is connected with the first pipe part and extended upwardly. The first pipe part is arranged between the base and the second fin group. The second pipe part is penetrated through the first fin group. The distance between a top surface of the first fin group and the base is larger than the distance between a top surface of the second fin group and the base. Since influences of the dissipating area and the wind resistance are taken into consideration, the heat dissipation device has enhanced heat dissipating efficacy.

Abstract: A water-cooling heat dissipating system includes a pump and a water-cooling head. The water-cooling head includes a base, a first chamber and a second chamber. The base is in contact with an electronic component. The first chamber and the second chamber are located over the base and separated from each other. The first chamber includes a first inlet and a first outlet. The first inlet is in fluid communication with the pump. The second chamber includes a second inlet and a second outlet. The second inlet is fluid communication with the first outlet. The liquid continuously flows through the first chamber and the second chamber. The heat from the electronic component is transferred to the liquid within the first chamber and the second chamber through the base, and released through the first outlet and the second outlet.

Abstract: A water-cooling heat dissipation module includes a hot-water heat exchange structure, a cold-water heat exchange structure, a fluid communication structure and a fan. The fluid communication structure is in communication with the hot-water heat exchange structure and the cold-water heat exchange structure. The fan and the hot-water heat exchange structure are opposed to each other with respect to the cold-water heat exchange structure. An airflow produced by the fan blows the cold-water heat exchange structure and the hot-water heat exchange structure sequentially. Consequently, the cold-water heat exchange structure will not receive the heat from the hot-water heat exchange structure through the airflow.