Abstract: A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

Abstract: A disclosed lighting apparatus includes a light-diffusive plate having opposing first and second faces bounded by one or more sides. A first electrically conductive sheet is disposed on the first face of the light-diffusive plate, and an electrically insulative sheet is disposed on the first electrically conductive sheet. A second electrically conductive sheet is disposed on the electrically insulative sheet. A plurality of solid-state lighting (SSL) elements have light emitting portions that face a portion of the light-diffusive plate. The SSL elements are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet.

Abstract: A disclosed RF tag includes a substrate and an integrated circuit (IC) package disposed on the substrate. The IC package has an integrated antenna element coupled to circuitry of the IC package. The RF tag also includes an external antenna element of round wire having at least one half turn disposed against two or more surfaces of the IC package. The external antenna element is inductively coupled to the integrated antenna element, and the IC package laterally supports the at least one half turn of the external antenna element.

Abstract: The disclosure describes a lighting apparatus that includes a light-diffusive panel having opposing first and second faces and two or more side portions. A side portion has a curved surface and a third surface. Solid-state lighting (SSL) elements are disposed proximate the third surface of the side portion and are arranged to emit light at the third surface. A first reflector is disposed on the curved surface of the side portion and has a reflective surface to reflect light from the SSL elements into the light-diffusive panel. A plurality of disruptions are formed on the second face of the light-diffusive panel and are arranged to disperse internally reflected light. A second reflector is disposed on the second face of the light-diffusive panel and is arranged to reflect light emitted from the second surface into the light-diffusive panel.

Abstract: A disclosed lighting apparatus includes a support structure having a sheet metal member. The sheet metal member has a first surface. An adhesive layer is directly attached to the first surface of the sheet metal member. A plurality of light-emitting diode (LED) components are attached to the sheet metal member by the adhesive layer. A plurality of wires are attached to the sheet metal member by the adhesive layer and are coupled to the plurality of LED components for providing power to the LED components.

Abstract: A disclosed circuit arrangement includes adhesive transfer tape having a layer of pressure sensitive adhesive (PSA) having a first major surface and a second major surface opposite the first major surface. One or more metal foil pads are attached directly to the second major surface of the layer of PSA. Electrically conductive round wire is attached directly to the second major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly to the second major surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

Abstract: The disclosed lighting arrangement includes adhesive transfer tape. The adhesive transfer tape has an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. Power wires are adhered directly to the adhesive layer, and solid state lighting elements are disposed on the adhesive layer and coupled to the power wires.

Abstract: A disclosed transponder arrangement includes a water soluble backing having first and second major surfaces. A layer of pressure sensitive adhesive (PSA) has a third major surface and a fourth major surface. The fourth major surface is directly adhered to the first major surface of the water soluble backing. One or more metal foil pads are attached directly on the third major surface of the layer of PSA. Electrically conductive round wire is attached directly on the third major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the metal foil pad(s) with weld joint(s). An RF transponder is attached directly on the third major surface of the first layer of PSA and is electrically connected to the one or more portions of the round wire by bond wire(s).

Abstract: A disclosed circuit arrangement includes a substrate having first bond pads coupled to a pattern of conductors. The first bond pads and the pattern of conductors are disposed on a first surface of the substrate. A first layer of adhesive is directly disposed on the first surface of the substrate and the pattern of conductors and has openings at the first bond pads. An electronic device has opposing first and second surfaces and is attached to the first surface of the substrate by the first surface of the electronic device in contact with the first layer of adhesive. The second surface of the electronic device has second bond pads. Bond wires are connected at the first bond pads through the openings in the first layer of adhesive and connected at the second bond pads.

Abstract: A method of attaching wire to an exposed surface of an adhesive layer includes guiding wire from a wire source through a payout head and through a foot of a write head. A first portion of the wire extends from the foot toward the adhesive layer. The write head is positioned such that a gap between the foot and the exposed surface of the adhesive layer is greater than a diameter of the wire. The write head is moved in a motion parallel to the adhesive layer, and the first portion of the wire adheres to the adhesive layer. Wire is pulled from the wire source by the payout head as the write head is moving in order to maintain slack in a second portion of the wire between the payout head and the write head as the wire is attached to the exposed surface of the adhesive layer.

Abstract: RFID tag structures are disclosed. In one embodiment, the RFID tag includes a flexible substrate, a strap attached to the substrate, an RFID IC mounted on the strap, and an antenna. The strap has a first surface, a second surface, and first and second terminals exposed on the first surface. The second surface of the strap is attached to the substrate. The RFID IC is electrically coupled to the first and second terminals. The antenna is attached to the first surface of the flexible substrate and connected to the first and second terminals on the first surface of the strap.

Abstract: A disclosed lighting apparatus includes a light-diffusive plate having opposing first and second faces bounded by one or more sides. A first electrically conductive sheet is disposed on the first face of the light-diffusive plate, and an electrically insulative sheet is disposed on the first electrically conductive sheet. A second electrically conductive sheet is disposed on the electrically insulative sheet. A plurality of light-emitting diodes (LEDs) have light emitting portions that face a portion of the light-diffusive plate. The LEDs are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet.

Abstract: A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

Abstract: A disclosed circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, first and second cross wires attached to the substrate and disposed proximate the electronic device, and one or more wire segments attached to the substrate. The one or more wire segments have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments are round wires having round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the electronic device and to the first portion of the one or more wire segments, and a second bond wire is connected to the electronic device and to the second portion of the one or more wire segments.

Abstract: A circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, and one or more round wire segments attached to the substrate. The one or more round wire segments have first and second portions for connecting to the IC component, and each first and second portion has a planar landing area extending longitudinally along the wire. The circuit arrangement further includes bond wires connecting the landing areas to the IC component.

Abstract: The disclosed lighting arrangement includes adhesive transfer tape. The adhesive transfer tape has an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. Power wires are adhered directly to the adhesive layer, and one or more light-emitting diodes (LEDs) are disposed on the adhesive layer and coupled to the power wires.

Abstract: A lighting module is disclosed and includes a light emitting diode (LED) panel having a plurality of LEDs and two or more conductive contacts. A boxlike member has a base and sidewalls. The sidewalls have passages that provide ingress to and egress from the boxlike member for power wires. One or more mounting members are attached to the boxlike member for removably attaching the LED panel. A circuit board is disposed in the boxlike member, and the circuit board includes two or more insertion force connectors for connecting to power wires. The circuit board further includes two or more board connectors that engage the conductive contacts of the LED panel and electrically couple the conductive contacts of the LED panel to the insertion force connectors.

Abstract: A lighting apparatus includes a light-diffusive plate having opposing faces bounded by one or more sides. The plate has disruptions on a first face of the opposing faces and a first channel along at least a portion of a first side of the one or more sides. A first cover has first and second surfaces disposed over the first channel with the first surface facing the first side of the light-diffusive plate. A plurality of light-emitting diodes (LEDs) is disposed on the first surface of the first cover and within the first channel. The LEDs electrically coupled with wiring are integrated with the first cover.

Abstract: Approaches for making a light-transmitting panel are disclosed. A panel is positioned on a support structure, and a stencil is positioned between a surface of the panel and a laser head. The stencil includes a plurality of openings. A defocused laser beam generated by the laser head is scanned over the openings in the stencil. The width of the defocused laser beam at a location at which the laser beam strikes the panel is at least as large as a size of the desired disruption, and the laser head is powered at a level and moved at a rate that creates a disruption in the surface of the panel at each opening.

Abstract: A tamper-resistant electronic system includes a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate. An RFID device has pins mechanically and electrically connected to the wiring on the first surface of the DV substrate. A plate has a first surface, and a portion of the first surface of the plate is adhered to a portion of the first surface of the DV substrate. The plate has a cavity that encompasses the RFID device. A backing is adhered to a second surface of the plate opposite the first surface of the plate.