Abstract: A USB connector is provided that has an OE module and high-speed electrical connections integrated therein. The OE module includes an optical module, at least one laser diode, at least one photodiode, an optical transceiver IC, and a PCB. The optical module, the laser diode, the photodiode, and the IC are mounted on a surface of the PCB. The OE module is secured within the USB connector. The PCB includes conductive traces and electrical contact pads. The conductive traces electrically connect the IC with the contact pads. The contact pads are electrically connected via through holes formed in the PCB to the high-speed electrical connections, which, in turn, are electrically connected to conductive traces of a motherboard or a computer.

Abstract: A method and an apparatus are provided for launching light into an entrance facet of a multimode optical fiber (MMF) of an optical link in a way that excites one or more higher-order Hermite Gaussian (HMG) mode groups in the MMF. Exciting higher-order HMG mode groups in the MMF increases the bandwidth of the link while also providing reduced modal noise. In addition, selectively exciting one or more higher-order HMG mode groups in the MMF ensures that the launch will provide desirable results even in cases where the connector that connects the end of the MMF to the optical transceiver or transmitter is offset with respect to the receptacle of the optical transceiver or transmitter. This feature allows for greater manufacturing tolerances when manufacturing the connectors and receptacles because precise alignment between them is not critical to achieving a successful launch.

Abstract: A polishing jig is provided that is capable of being used with different types, styles, and numbers of optical axes. For example, the polishing jig may be used with a variety of simplex connectors and with duplex connectors of at least first and second types. The first and second types of duplex connectors have different distances between the optical axes of their respective ferrules. The polishing jig may also be used with optical connectors having three or more ferrules having three or more respective optical axes.

Abstract: An optical connector is provided having a housing with a cavity formed therein through which an optical fiber passes. Within the cavity, a slightly bent, unjacketed portion of the core of the optical fiber is disposed. If conditions are such that pistoning of the core begins to occur, the slightly bent, unjacketed portion of the core straightens, thereby causing the end of the core to remain substantially flush with the end of the ferrule of the connector housing. In this way, the pistoning effect at the end of the fiber is prevented and optical losses associated with the occurrence of the pistoning effect are avoided.

Abstract: Embodiments of the invention include a fiber connector module and method for coupling optical signals between an optical transceiver module and an optical fiber described herein involve the coupling to or overmolding of a fiber connector module to an optical transceiver module or other optical source, and a fiber lens coupled to for formed into an angled surface of the fiber connector module housing. The angled surface and the fiber lens are configured in such a way that the fiber lens focuses collimated light from the transceiver module to the receiving end of an optical fiber or other optical detector positioned within the fiber connector module housing. Fiber connector modules according to embodiments of the invention allow for relatively low profiles compared to conventional arrangements and configurations, especially with multi-channel, parallel lane configurations.

Abstract: A surface-emitting semiconductor laser device is provided that includes an edge-emitting laser integrated in a semiconductor material with various reflectors and a diffractive lens. The edge-emitting laser has a first section comprising an active MQW region, a second section comprising a passive region and a third section comprising a semi-insulating or un-doped semiconductor bulk layer. This configuration ensures that the injection current will pass through all of the layers of the active region, thereby preventing the occurrence of optical losses due to un-injected areas of the MQW active region. In addition, the inclusion of the passive region ensures that there is no current passing through the interface between the active MQW region and the regrown semiconductor bulk layer. The latter feature improves performance and device reliability.

Abstract: An optical transceiver module is provided with a delatch device that is configured for pushing and pulling an optical transceiver module into and out of a cage. The delatch device includes an elongated handle having at least one strength member integrally formed therein or secured thereto that provides the handle with a sufficient moment of inertia to prevent the handle from bending or buckling when a force is being applied to the elongated handle to push an optical transceiver module into a cage. The elongated handle allows a module to easily be inserted into a cage by a user without the user having to directly access the front face of the module.

Abstract: An AOC connector is provided that has a molded plastic leadframe that obviates the need to use an optical connector in the AOC and that is capable of operating over a wide temperature range and a large number of temperature cycles. The AOC connector includes a plastic optical port that is adapted to be connected via an optically-transparent adhesive material to an end of an optical fiber cable.

Abstract: A surface-emitting semiconductor laser device is provided that includes an edge-emitting laser integrated in a semiconductor material with various reflectors and a diffractive lens. The edge-emitting laser has a first section comprising an active MQW region, a second section comprising a passive region and a third section comprising a semi-insulating or un-doped semiconductor bulk layer. This configuration ensures that the injection current will pass through all of the layers of the active region, thereby preventing the occurrence of optical losses due to un-injected areas of the MQW active region. In addition, the inclusion of the passive region ensures that there is no current passing through the interface between the active MQW region and the regrown semiconductor bulk layer. The latter feature improves performance and device reliability.

Abstract: Methods and apparatuses are provided for preventing flex circuits of optical transceiver modules from being damaged during the process of manufacturing and assembling the optical transceiver modules. Preventing the flex circuits from being damaged during the manufacture and assembly processes increases yield and decreases costs. In addition, the methods and apparatuses that are used to prevent the flex circuits from being damaged also allow the processes of forming the mechanical bends and inserting the modules into their respective housings to be automated. Automating these processes further increases yield and decreases costs.

Abstract: Systems and methods for balanced cooling of electrical systems, including electrical systems containing transceivers used in electrical and optical communication. An electrical system includes a cage, where the cage has a top, front and bottom. The cage contains a plurality of upper bays disposed in the front of the cage. Each of the plurality of upper bays is configured to receive a transceiver. The cage also contains a plurality of lower bays disposed in the front of the cage. Each of the lower bays is configured to receive a transceiver. Additionally, each of the plurality of upper bays is stacked on one of the plurality of lower bays. An upper heat sink extends from the outer surface of the top of the cage and a lower heat sink extends from the outer surface of the bottom of the cage.

Abstract: A heat dissipation solution is provided that includes a heat sink structure that has a very high thermal conductivity and includes elements or features that can be deformed to increase the contact surface areas between the heat sink structure and the module casing, thereby decreasing thermal resistance. By increasing the thermal conductivity and the sizes of the surface areas that are used for transferring heat, the temperature difference between the temperature of the light source and the temperature of the module casing can be decreased to enable the light source to be operated at higher data rates. Furthermore, deformation of the deformable features also removes space between the optical subassembly and the module body caused by mechanical tolerance differences that occur during manufacturing.

Abstract: An optical transceiver module is provided with an elongated delatching pull tab that that enables an optical transceiver module to be easily delatched and pulled from a cage without having to first unplug optical fiber cables from the module and without having to rotate a bail. Thus, the number of manual actions that need to be performed by a user to remove the module from a cage is drastically reduced, which makes simplifies the removal process and makes the design well suited for use in hot-pluggable environments. In addition, the delatching pull tab obviates the need for pins or screws, thereby improving manufacturing yield by reducing the likelihood that the module will be damaged during the manufacturing process. In addition, by eliminating pins or screws and a bail from the design, there are fewer moving parts that can wear out over time.

Abstract: A parallel optical communications device is provided that has an OSA that includes at least one heat dissipation block having a slot formed in a lower surface thereof that contains a weldable insert. Likewise, an upper surface of the mounting device of the ESA has at least one slot formed therein that contains a weldable insert. After the OSA is placed in contact with the ESA and optically aligned with the ESA, the OSA is secured to the upper surface of the mounting device of the ESA by welding together the respective weldable inserts contained in the respective slots in the OSA and in the mounting device of the ESA. The welding process results in an extremely strong welded joint between the OSA and the ESA that prevents relative movement between the OSA and the ESA if external forces that are exerted on the OSA and/or on the ESA.

Abstract: A half-duplex, single-fiber (S-F) optical transceiver module is provided in which a light source, such as a laser diode or a light-emitting diode (LED), is mounted on an edge region of a photodiode to increase the amount of surface area of the photodiode that is available for absorbing light received in the optical transceiver module. The S-F optical transceiver module has a relatively simple optical coupling system for coupling light between an end face of an optical fiber and the photodiode and laser diode or LED with high optical coupling efficiency and reduced optical crosstalk.

Abstract: An FC-type optoelectronic assembly is provided that has a threaded plastic body that is adapted to mate with a threaded sleeve of an FC plug by engaging the threaded sleeve the FC plug with the threaded body of the FC-type optoelectronic assembly. The threaded plastic body is transparent to an operational wavelength of the FC-type optoelectronic assembly and has an optical element integrally formed therein. A TO-can header is housed in the threaded plastic body. A miniature PCB may be used for mounting the electrical and optoelectronic components of the TO-can header assembly on the header of the TO-can header assembly.

Abstract: Alignment of one or more lenses with one or more opto-electronic devices in an opto-electronic system is aided by an aligner device having a substantially cylindrical body with a base and an outer ring. The base has one or more openings, one of which is a first opto-electronic device opening. The first opto-electronic device opening has a substantially circular shape coaxial with the outer ring and coaxial with a central axis of the aligner device.

Abstract: D-shaped POFs are used to form a 2-to-1 optical coupler. The D-shaped POFs are produced via an extrusion process that is relatively inexpensive to perform and that can be performed with relatively high manufacturing throughput. The D-shaped POFs are bonded together to form a coupler end face having a generally circular cross-sectional area. The coupler end face is interfaced with an end face of a main POF that is generally circular in cross-sectional shape. The resulting D-shaped 2-to-1 optical POF couplers have relatively low insertion loss and relatively high optical coupling efficiency.

Abstract: An optical assembly can be formed by providing a frame made of a plastic material on a surface of a printed circuit board (PCB), mounting at least one opto-electronic element on the surface of the PCB within the frame, and laser-welding a lens device onto the frame.

Abstract: An optical transceiver and method for bidirectionally communicating optical signals in an optical transceiver involve an optical element that bidirectionally separates incoming and outgoing optical signals of the same wavelength. The optical element can be a diffractive element such as a grating or, alternatively, a partially reflective element such as a transparent block having a thin-film coating.