Patents Assigned to Avago Technologies Sensor IP (Singapore) Pte. Ltd.
  • Patent number: 7112774
    Abstract: A pair of CMOS image sensors is provided. One of the pair of CMOS image sensors is assigned as a master CMOS image sensor and the other is assigned as a slave CMOS image sensor. The slave CMOS image sensor is synchronized to the master CMOS image sensor during image data acquisition. In one embodiment, the master CMOS image sensor and the slave CMOS image sensor are connected to receive a control signal, which assigns the master CMOS image sensor as master and the slave CMOS image sensor as slave. In another embodiment, the master CMOS image sensor and slave CMOS image sensor are hardwired to assign the master and slave. In yet another embodiment, the data signals from the master CMOS image sensor and slave CMOS image sensor are interleaved.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: September 26, 2006
    Assignee: Avago Technologies Sensor IP (Singapore) Pte. Ltd
    Inventor: Richard L. Baer
  • Patent number: 7095621
    Abstract: A leadless optical electronic package includes a lead frame having a die-attach pad and a plurality of leadless connection pads encapsulated in and extending through an encapsulation defining a planar mounting surface that can be soldered directly to a circuit board. The die-attach pad and connection pads define internal surfaces that remain partially exposed through the encapsulation. The internal surfaces are for attaching an electronic die and making electrical connections between the die and the connection pads. A die mounted on the die-attach pad is cooled more effectively and efficiently than dice in prior optical electronic packages. The leadless connection pads reduce the footprint and height of the package compared with prior optical electronic packages. The encapsulation is adapted for receiving a cover having a cover glass to allow light to pass though the cover and illuminate the die. The cover is adapted to receive an optics component for projecting light through the cover glass onto the die.
    Type: Grant
    Filed: February 24, 2003
    Date of Patent: August 22, 2006
    Assignee: Avago Technologies Sensor IP (Singapore) Pte. Ltd.
    Inventors: Lee Saimun, Gurbir Singh, Chin Yee Loong
  • Patent number: 7095159
    Abstract: Devices with mechanical drivers for displaceable elements are described. In one aspect, a device includes a displaceable element, a driver, and a controller. The driver includes a plurality of actuatable drive elements. Each drive element has a respective engagement area that is operable to move from a respective start position to a respective end position and back to the start position. During movement from the start position to the end position the engagement area is engaged with the displaceable element and applies a mechanical force urging the displaceable element to move. During movement from the end position to the start position the engagement area is disengaged from the displaceable element. The controller is configured to choreograph the operation of the actuatable drive elements in moving the displaceable element.
    Type: Grant
    Filed: June 29, 2004
    Date of Patent: August 22, 2006
    Assignee: Avago Technologies Sensor IP (Singapore) Pte. Ltd.
    Inventor: Akihiro Machida