Patents Assigned to Avant Technology, Inc.
  • Patent number: 10101637
    Abstract: The present invention is a supplemental waterproof housing that completely surrounds a camera device, and it encloses an integrated and removable supplemental external battery and supplemental memory storage inside the external housing, and provides for a mounting point for lenses, filters or adaptors and handles attached to outside to the external housing. The internal compartment of the housing encloses an inner housing that holds the camera, and allows easy connections to the removable memory chips and removable battery packs through coupling adapters, connectors and bridges, which is all integrated into and enclosed by the external housing. The present invention also allows access to the internal compartment with one side of the inner housing providing a seal on one side of the waterproof housing, which is secured through waterproof seals, couplings and latches on the outside of the housing.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: October 16, 2018
    Assignee: Avant Technology, Inc.
    Inventors: Tim Peddecord, Justin M. Goodwin, Paul M. Goodwin
  • Publication number: 20170078537
    Abstract: The present invention is a supplemental waterproof housing that completely surrounds a camera device, and it encloses an integrated and removable supplemental external battery and supplemental memory storage inside the external housing, and provides for a mounting point for lenses, filters or adaptors and handles attached to outside to the external housing. The internal compartment of the housing encloses an inner housing that holds the camera, and allows easy connections to the removable memory chips and removable battery packs through coupling adapters, connectors and bridges, which is all integrated into and enclosed by the external housing. The present invention also allows access to the internal compartment with one side of the inner housing providing a seal on one side of the waterproof housing, which is secured through waterproof seals, couplings and latches on the outside of the housing.
    Type: Application
    Filed: September 9, 2016
    Publication date: March 16, 2017
    Applicant: Avant Technology, Inc.
    Inventors: Tim Peddecord, Justin M. Goodwin, Paul M. Goodwin
  • Patent number: 9402308
    Abstract: A high speed, high reliability circuit module and connective strategy that is connectively compliant with a receptacle in compliance with the SFF-8639 Specification whether expressing for example a PCIe interface or a high speed SAS interface. The present invention reduces impedance discontinuity by reducing the interconnection length and cross-planar transit found in typical specification compliant connectors.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: July 26, 2016
    Assignee: Avant Technology, Inc.
    Inventor: Paul Goodwin
  • Patent number: 9301415
    Abstract: A circuit module configured for connective mating with standards compliant receptacles includes a PCB configured with one or more tabs populated with conductive pads for connection to the receptacle. In preferred embodiments, the tab or tabs emerge from a circuit module case configured to be substantially compliant with dimensional requirements for connectors that couple with receptacles compliant with various specifications including, in preferred embodiments, the SFF 8639 or SATA Specifications.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: March 29, 2016
    Assignee: AVANT TECHNOLOGY, INC.
    Inventors: Paul Goodwin, Tim Peddecord
  • Publication number: 20150163944
    Abstract: A circuit module configured for connective mating with standards compliant receptacles includes a PCB configured with one or more tabs populated with conductive pads for connection to the receptacle. In preferred embodiments, the tab or tabs emerge from a circuit module case configured to be substantially compliant with dimensional requirements for connectors that couple with receptacles compliant with various specifications including, in preferred embodiments, the SFF 8639 or SATA Specifications.
    Type: Application
    Filed: February 19, 2015
    Publication date: June 11, 2015
    Applicant: AVANT TECHNOLOGY, INC.
    Inventors: Paul Goodwin, Tim Peddecord
  • Publication number: 20150144383
    Abstract: A high speed, high reliability circuit module and connective strategy that is connectively compliant with a receptacle in compliance with the SFF-8639 Specification whether expressing for example a PCIe interface or a high speed SAS interface. The present invention reduces impedance discontinuity by reducing the interconnection length and cross-planar transit found in typical specification compliant connectors.
    Type: Application
    Filed: February 2, 2015
    Publication date: May 28, 2015
    Applicant: Avant Technology, Inc.
    Inventor: Paul Goodwin
  • Patent number: D785069
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: April 25, 2017
    Assignee: Avant Technology, Inc.
    Inventors: Justin M. Goodwin, Paul M. Goodwin
  • Patent number: D794697
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: August 15, 2017
    Assignee: Avant Technology, Inc.
    Inventors: Paul M. Goodwin, Justin M. Goodwin