Abstract: A machine and method for high speed production of circuit patterns on silicon wafers or similar substrates may be used for applications including printing Integrated Circuit (IC) packaging patterns onto wafers prior to separating IC chips. Projection camera(s) simultaneously project image(s) onto substrate(s) carried on an X, Y, ? stage. The projection camera(s) may include independent alignment systems, light sources, and control of focus, image placement, image size, and dose. In one embodiment, each camera includes a 6-axis reticle chuck that moves a reticle to correct image-to-substrate overlay errors. In-stage metrology sensors and machine software establish and maintain the correct relationship among the machine's coordinate systems. Thus, two or more projection cameras can print simultaneously even when substrates are slightly misplaced on the X, Y, ? stage.
Type:
Grant
Filed:
May 28, 2004
Date of Patent:
June 10, 2008
Assignee:
Azores Corporation
Inventors:
Steven D. Gardner, Elvino M. da Silveira, Griffith L. Resor, III
Abstract: A machine and method for high speed production of circuit patterns on silicon wafers or similar substrates may be used for applications including printing Integrated Circuit (IC) packaging patterns onto wafers prior to separating IC chips. Projection camera(s) simultaneously project image(s) onto substrate(s) carried on an X, Y, ? stage. The projection camera(s) may include independent alignment systems, light sources, and control of focus, image placement, image size, and dose. In one embodiment, each camera inlcudes a 6-axis reticle chuck that moves a reticle to correct image-to-substrate overlay errors. In-stage metrology sensors and machine software establish and maintain the correct relationship among the machine's coordinate systems. Thus, two or more projection cameras can print simultaneously even when substrates are slightly misplaced on the X, Y, ? stage.
Type:
Application
Filed:
May 28, 2004
Publication date:
December 1, 2005
Applicant:
Azores Corporation
Inventors:
Steven Gardner, Elvino da Silveira, Griffith Resor
Abstract: Misalignment errors in a lithographic system resulting from the effect of environmental changes on the lens system itself are detected and corrected. A fiducial on the reticle adjacent to its working area is projected through the lens. A metrology plate carried by the lens holds reference mirrors and detectors. The reference mirrors receive the resultant image and reflect it to detectors in a reflected image plane. This provides feedback to the reticle alignment system as to the extent of misalignment, if any. Correction is made by moving the reticle until alignment is achieved and detected. This motion is achieved by using a reticle chuck with linear motors.