Abstract: Folded cantilever structures and solid state force transducers using same are made by chemical etching of a semiconductive wafer. In the chemical etching process, an etch stop layer is provided on a wafer of semiconductive material. The etch stop layer is opened in a certain pre-determined pattern and etchant is introduced through the opening in the etch stop layer to produce substantial undercut etching of portions of the etch stop layer. The opening is patterned to define a support structure (frame) for the folded cantilever portion which is undercut. The etch is terminated such that one end of the undercut folded cantilever structure is supported from the frame and the other end terminates on a structure such as a mass that is supported from the frame by means of the folded cantilever structure.

Abstract: Miniature thermal fluid flow sensors of the airfoil type are made in batch form by forming the thermal fluid flow sensors on a thin sheet of material and bonding the sheet over an array of duct structures and dicing the individual sensors and duct structures apart. In one thermal flow sensor configuration, a flow heater is dispsoed inbetween first and second thermal flow sensors in heat exchanging relation therewith. A third thermal flow sensor is disposed upstream of the others out of heat exchanging relation with the heater for operation of the heater at a certain temperature above that sensed by the third sensor. In the low flow regime, flow is measured by the difference between the outputs of the first and second sensors, whereas in the high flow regime, the power required to maintain the temperature of the heater serves as a measure of the flow.

Abstract: An etch stopped layer portion overlying a (100) or (110) major face of a diamond cubic semiconductor material is undercut anisotropically etched by orienting a side edge of the etch stopped layer portion which is to be undercut, at an angle to the most nearly parallel {111} trace on the (100) or (110) face. The etch time is further reduced by slotting through the etch stopped layer with slots oriented at an angle to the {111} traces on the underlying (100) or (110) face. Undercut bridge structures are formed by undercutting quadrilateral etch stopped layer portions from opposite sides of the quadrilateral or from the sides plus slots forming diagonals of {111} trace quadrilaterals having combined areas coextensive with the area to be undercut.

Abstract: Three dimensional single crystalline structures, such as folded cantilever beams supported from a frame and supporting a central structure free to move relative to the frame, are fabricated by anisotropically etching through openings in etch stop layers on opposite sides of the substrate wafer. The openings are patterned and aligned so that the etch stop layers are undercut to define etch stop portions interconnected by unetched substrate material.

Abstract: In a miniature valve, a valve seat is formed by aperturing a plate. A cantilever leaf spring is disposed overlying the apertured plate for controlling the flow of fluid therethrough. An electrostatic potential applied between the cantilever leaf spring and the valve plate pulls the leaf spring over the apertured plate for variably controlling flow through the valve in accordance with the magnitude of the applied potential. In a preferred embodiment, the cantilever leaf springs are made in batch form by etching a silicon wafer. A flow controller is provided by measuring the electrical capacitance of the valve, comparing it with a reference voltage and deriving a feedback voltage applied to the valve for controlling flow therethrough. In one embodiment, the width of the cantilever leaf spring valve member is narrowed toward its free end for finer control of flow.

Abstract: Displacement of a movable transducer element is measured by exciting a capacitive gap (preferably differential capacitive gaps) with triangular waves of voltage to obtain a square current wave output into a zero input impedance amplifier. The square wave output is amplified and synchronously detected to produce a d.c. output signal proportional to displacement. The d.c. output signal is fed back to force rebalance electrodes to electrostatically rebalance the movable transducer element. The feedback signal is a measure of the force being transduced. Initial offsets in the position of the transducer element and capacitances of the capacitive gaps are compensated by signals derived from the capacitive gap excitation waveforms.

Abstract: Solid state folded leaf spring force transducers are fabricated by batch photolithographic and etching techniques from a monocrystalline material, such as silicon. The folded leaf spring structure includes elongated gaps separating adjacent leaf spring leg portions, such elongated gaps being oriented parallel to a crystallographic axis of the monocrystalline material. In a preferred embodiment the monocrystalline material is of diamond cubic type and the leaf spring gaps extend in mutually orthogonal directions parallel to the <011> and <011> crystallographic axes, respectively. In a preferred method of fabricating the spring structure, the structure is etched from a monocrystalline wafer by means of an anisotropic etchant so as to more precisely define angles and dimensions of the resultant spring structure.